Multiprotokoll-Module

Ergebnisse: 1.596
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Menge RoHS ECAD Model Serie
Frequenz
Ausgangsleistung
Schnittstellen-Typ
Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Antennenanschlusstyp
Abmessungen
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – Mobilfunk, NBIoT, LTE
Protokoll – GPS, GLONASS
Protokoll – Sub-GHz
Protokoll – WLAN – 802.11
Protokoll – ANT, Thread, Zigbee – 802.15.4
Qualifikation
Verpackung
Murata Electronics Multiprotokoll-Module Type 2DL-921, Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module
Datenblatt
1.425Auf Bestellung
MouseReel verfügbar
Min.: 1
Mult.: 1
: 1.000

2DL 2.4 GHz, 5 GHz 18 dBm UART 1.71 V 3.46 V - 40 C + 85 C u.FL 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 Reel, Cut Tape, MouseReel
Murata Electronics Multiprotokoll-Module Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module Type 2EL
Datenblatt
3.993Auf Bestellung
MouseReel verfügbar
Min.: 1
Mult.: 1
: 1.000

2EL 2.4 GHz, 5.8 GHz 20 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
Murata Electronics Multiprotokoll-Module Type 1ZM Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.1
Datenblatt
2.000erwartet ab 21.01.2027
Min.: 1
Mult.: 1
: 1.000

1ZM 2.4 GHz, 5 GHz 17 dBm SDIO, UART 1.62 V 1.92 V - 30 C + 85 C u.FL 10.2 mm x 9.3 mm x 1.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Reel, Cut Tape
NXP Semiconductors IW611UK/A1IZ
NXP Semiconductors Multiprotokoll-Module IW611UK/A1I
Datenblatt
25erwartet ab 21.08.2026
Min.: 1
Mult.: 1
: 2.000

IW611HN Reel, Cut Tape
NXP Semiconductors IW612UK/A1IZ
NXP Semiconductors Multiprotokoll-Module IW612UK/A1I
Datenblatt
25erwartet ab 21.08.2026
Min.: 1
Mult.: 1
: 2.000

IW612HN Reel, Cut Tape
Quectel Multiprotokoll-Module Cat 4 + 3G, 4Gbit ROM+2Gbit RAM, North America, mPCIe form factor
Datenblatt
394Auf Bestellung
Min.: 1
Mult.: 1
: 100

700 MHz to 5 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel Multiprotokoll-Module Cat 4 + 3G + 2G module, mPCIe form factor, EMEA, South Korea, Thailand, India
Datenblatt
385erwartet ab 01.06.2026
Min.: 1
Mult.: 1
: 100

698 MHz to 960 MHz, 1.561 GHz, 1.575 GHz, 1.7 GHz to 2.7 GHz, 2.4 GHz to 2.5 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C External 30 mm x 51 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Murata Electronics Multiprotokoll-Module Type 2FY Infineon CYW55513 ShieldedSmall WiFi 11a/b/g/n/ac/ax SISO+BT 5.4 Module
Datenblatt
984erwartet ab 18.09.2026
Min.: 1
Mult.: 1
: 1.000

2FY 2.4 GHz, 5 GHz, 6 GHz GPIO, UART 3 V 4.8 V - 40 C + 85 C 7.9 mm x 7.3 mm x 1.1 mm Bluetooth WiFi - 802.11 Reel, Cut Tape
Murata Electronics Multiprotokoll-Module Type 1DX Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 4.1
920erwartet ab 09.06.2026
MouseReel verfügbar
Min.: 1
Mult.: 1
: 1.000

1DX 2.4 GHz 17 dBm SDIO, UART 1.71 V 3.63 V - 30 C + 70 C External 6.95 mm x 5.15 mm x 1.1 mm Bluetooth 4.1 802.11 b/g/n Reel, Cut Tape, MouseReel
Murata Electronics Multiprotokoll-Module Type 2FR module
Datenblatt
975erwartet ab 03.11.2026
Min.: 1
Mult.: 1
: 1.000

2FR 2.484 GHz 18 dBm SPI 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.5 mm Reel, Cut Tape

Murata Electronics Multiprotokoll-Module Type 2BP NXP SR150 UWB MODULE
Datenblatt
999erwartet ab 23.09.2026
Min.: 1
Mult.: 1
: 1.000

UWB 6.25 GHz to 8.25 GHz SPI - 30 C + 85 C 6.6 mm x 5.8 mm x 1.2 mm Reel, Cut Tape
Murata Electronics Multiprotokoll-Module Type 2DS Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth
Datenblatt
1.000erwartet ab 02.10.2026
Min.: 1
Mult.: 1
: 500

2DS 2.4 GHz USB 3 V 3.6 V - 40 C + 85 C 25 mm x 14 mm x 2.4 mm Reel, Cut Tape
Murata Electronics Multiprotokoll-Module Type 1XK Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.2
Datenblatt
972erwartet ab 24.12.2026
Min.: 1
Mult.: 1
: 500

1XK 2.4 GHz, 5 GHz UART 2.7 V 5.5 V - 40 C + 85 C u.FL 9.1 mm x 8.3 mm x 1.3 mm Bluetooth 5.2 Reel, Cut Tape
Quectel Multiprotokoll-Module Cat M1/Cat NB2/EGPRS + GNSS (w/o WWAN concurrency), no VoLTE
Datenblatt
500erwartet ab 20.08.2026
Min.: 1
Mult.: 1
: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Built-In 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS Reel, Cut Tape
Quectel Multiprotokoll-Module Cat M1/Cat NB2 - Standard version + GNSS (w/o WWAN concurrency)
Datenblatt
791Auf Bestellung
MouseReel verfügbar
Min.: 1
Mult.: 1
: 500

21 dBm ADC, GPIO, I2C, PCM, USB 2.0, UART 2.6 V 4.8 V - 35 C + 75 C RP-SMA 14.9 mm x 12.9 mm x 1.7 mm LTE Cat-M1/NB2 GLONASS, GPS Reel, Cut Tape, MouseReel
Quectel Multiprotokoll-Module Cat 4 + 3G, 1Gbit ROM+1Gbit RAM, data only application, North America, mPCIe form factor
Datenblatt
100Auf Bestellung
Min.: 1
Mult.: 1

824 MHz to 960 MHz, 1.71 GHz to 2.17 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Tray
Quectel Multiprotokoll-Module Cat 4 + 3G + 2G, 4Gbit ROM+2Gbit RAM, Support B5, EMEA, South Korea, Thailand, India
Datenblatt
250erwartet ab 04.08.2026
Min.: 1
Mult.: 1
: 250

700 MHz to 960 MHz 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.8 V 3.8 V - 35 C + 75 C External 32 mm x 29 mm x 2.4 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel Multiprotokoll-Module Cat 4 + 3G + 2G module, mPCIe form factor, EMEA, Thailand
Datenblatt
289Auf Bestellung
Min.: 1
Mult.: 1
: 100

1.16 GHz to 1.27 GHz, 1.56 GHz to 1.605 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C 30 mm x 51 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel Multiprotokoll-Module Cat 4 + 3G + 2G module, mPCIe form factor, EMEA, Thailand
Datenblatt
99erwartet ab 06.08.2026
Min.: 1
Mult.: 1

Tray
Quectel Multiprotokoll-Module Cat 4 + 3G, 4Gbit ROM+2Gbit RAM, Japan only, mPCIe form factor
Datenblatt
100erwartet ab 29.06.2026
Min.: 1
Mult.: 1
: 100

I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C Patch 30 mm x 51 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel Multiprotokoll-Module Cat 1 + 3G + 2G, 1Gbit ROM+1Gbit RAM, Global
Datenblatt
250erwartet ab 01.06.2026
Min.: 1
Mult.: 1
: 250

33 dBm ADC, I2C, PCM, SD Card, SGMII, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 GNSS Reel, Cut Tape
Quectel Multiprotokoll-Module Cat 1 + 3G + 2G, mPCIe form factor, Global
Datenblatt
200erwartet ab 26.08.2026
Min.: 1
Mult.: 1
: 100

33 dBm I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C 51 mm x 30 mm x 4.9 mm LTE Cat 1 GNSS Reel, Cut Tape
SparkFun Multiprotokoll-Module ESP32-C6 is Espressif s first WiFi 6 SoC integrating 2.4 GHz WiFi 6 Bluetooth 5 (LE) and the 802.15.4 protocol. It features an industry-leading RF performance with reliable security features and multiple memory resources for IoT products. It cons
Datenblatt
29erwartet ab 03.07.2026
Min.: 1
Mult.: 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee
Quectel Multiprotokoll-Module cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, 2MB flash
110Auf Bestellung
Min.: 1
Mult.: 1
: 250
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Telink Multiprotokoll-Module Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
Min.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel