5G Automotive- und Transportlösungen

Die 5G-Konnektivität für Automotive- und Transportlösungen von Samtec erfüllt die Anforderungen des wachsenden 5G-Netzwerkmarktes. Da die Implementierung des 5G-Netzwerks schnell an Dynamik gewinnt, werden neue Hochleistungsbauteile, Systeme sowie Prüf- und Messgeräte benötigt, um die extrem hohen Frequenzen und hohen Datenraten zu unterstützen, die Technologien wie mmWave, Massive MIMO, Strahlformung und Vollduplex-Anforderungen erfordern. Samtec bietet Hochleistungsverbindungen zusammen mit hohem technischem Know-how zur Unterstützung dieser Anforderungen, einschließlich eines wachsenden Portfolios von Lösungen, die sich hervorragend für Fahrzeuganwendungen eignen.

Ergebnisse: 4.277
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Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Produkt
Anzahl der Positionen
Abstand
Anzahl der Zeilen
Montage
Montagewinkel
Stackhöhe
Nennstrom
Nennspannung
Maximale Datenrate
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Kontaktüberzug
Kontaktmaterial
Gehäusematerial
Serie
Verpackung
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
1.166Auf Lager
Min.: 1
Mult.: 1

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 25 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
745Auf Lager
Min.: 1
Mult.: 1
: 250

Sockets 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50MM Q PAIRS HS SOCKET STRIP
Datenblatt
20.579Auf Lager
MouseReel verfügbar
Min.: 1
Mult.: 1
: 525

7 Position 2.54 mm (0.1 in) Solder QSH Reel, Cut Tape, MouseReel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
1.185Auf Lager
Min.: 1
Mult.: 1
: 225

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
1.894Auf Lager
Min.: 1
Mult.: 1
: 100

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 16 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
400Auf Lager
Min.: 1
Mult.: 1
: 75

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
2.868Auf Lager
Min.: 1
Mult.: 1
: 250

Sockets 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
1.377Auf Lager
Min.: 1
Mult.: 1
: 200

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
860Auf Lager
Min.: 1
Mult.: 1
: 225

Headers 320 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
100Auf Lager
Min.: 1
Mult.: 1
: 100

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
200Auf Lager
Min.: 1
Mult.: 1
: 200

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm Q Strip High-Speed Ground Plane Socket Strip
Datenblatt
133Auf Lager
Min.: 1
Mult.: 1

Sockets 84 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 5 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Datenblatt
329Auf Lager
Min.: 1
Mult.: 1

Sockets 40 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header
Datenblatt
316Auf Lager
Min.: 1
Mult.: 1

Connectors 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header
Datenblatt
1.060Auf Lager
Min.: 1
Mult.: 1
: 150

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 11 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header
Datenblatt
683Auf Lager
Min.: 1
Mult.: 1
: 100

Headers 120 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 16 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
272Auf Lager
Min.: 1
Mult.: 1
: 150

Headers 180 Position 0.5 mm (0.02 in) 2 Row Solder Straight 11 mm 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
385Auf Lager
Min.: 1
Mult.: 1
: 375

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
107Auf Lager
Min.: 1
Mult.: 1
: 225

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
60Auf Lager
Min.: 1
Mult.: 1
: 75

Headers 200 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
94Auf Lager
Min.: 1
Mult.: 1
: 125

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
186Auf Lager
Min.: 1
Mult.: 1
: 225

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
61Auf Lager
Min.: 1
Mult.: 1
: 200

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
240Auf Lager
Min.: 1
Mult.: 1
: 225

Headers 100 Position 1.27 mm (0.05 in) 5 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
82Auf Lager
Min.: 1
Mult.: 1
: 100

Connectors 300 Position 1.27 mm (0.05 in) 10 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape