ROHM Semiconductor BST400D12P4A1x1 TRCDRIVE pack™ with Molded Modules
ROHM Semiconductor BST400D12P4A101 and BST400D12P4A111 TRCDRIVE pack™ with 2-in-1 SiC Molded Modules feature 1200V rated voltage in a compact package with 41.6mm × 52.5mm dimensions. These modules integrate 4th Generation SiC MOSFETs for a power-dense design that greatly reduces the size of electric vehicle (xEV) inverters. ROHM Semiconductor BST400D12P4A101 and BST400D12P4A111 modules support up to 300kW and feature a terminal configuration designed to meet the critical challenges of traction inverters regarding miniaturization, higher efficiency, and fewer person-hours. These modules do not require soldering for the signal terminals, offering ease of use for designers.
Features
- Combination of press-fit pins and molding technology results in smaller design
- High power density due to higher heat dissipation and lower stray inductance
- Ease of use, including no soldering for signal terminals
- Discrete packaging production system for high productivity
- Designed for automotive traction inverters
- AQG 324 qualified
Specifications
- 1200VDSS maximum voltage
- 394A maximum DC current
- Maximum AC current
- BST400D12P4A101: 326A
- BST400D12P4A111: 336A
- 2.8mΩ maximum RDS(on)
- Heat sink assembly
- BST400D12P4A101: TIM: heat dissipation sheet
- BST400D12P4A111: Ag sinter
- 41.6mm × 52.5mm dimensions
TRCDRIVE pack
Power-Dense Design
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ROHM Semiconductor BST740D08P4A1x4 TRCDRIVE pack™ with Molded Modules
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ROHM Semiconductor BST580D12P4A1x1 TRCDRIVE pack™ with Molded Modules
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Veröffentlichungsdatum: 2024-06-19
| Aktualisiert: 2024-06-19