UDx6 AcceleRate® mP 0,635-mm-Signal/Leistungsarrays

Samtec UDx6 AcceleRate® mP 0,635-mm-Signal/Leistungsarrays sind hochdichte Hochgeschwindigkeits-Signal-/Leistungsarrays mit einem Rastermaß von 0,635 mm, die PAM4-Geschwindigkeiten von 64 GBit/s erreichen. Diese Signal-/Leistungsarrays von Samtech verfügen über Power Blades für eine verbesserte Leistung und einen vereinfachten Breakout-Bereich (BOR). Die Baureihe UDx6 AcceleRate MP bietet Stapelhöhen von 5 mm und 10 mm sowie bis zu 10 Leistungs- und 240 Signalpositionen. Die Signal-/Leistungsarrays verfügen über ein Design mit offenem Pin-Feld für Flexibilität bei Routing und Erdung. Die Baureihe umfasst optionale Ausrichtungspins, Standard-Lötfahnen für eine sichere Verbindung zur Platine und polarisierte Führungsstifte für das Blindstecken.

Ergebnisse: 40
Auswählen Bild Teile-Nr. Herst. Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern. Menge RoHS ECAD Model Produkt Anzahl der Positionen Abstand Anzahl der Zeilen Montage Montagewinkel Nennstrom Nennspannung Maximale Datenrate Minimale Betriebstemperatur Maximale Betriebstemperatur Kontaktüberzug Kontaktmaterial Gehäusematerial Übertragungsgeschwindigkeit Serie
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket 25Auf Lager
14,11 €
13,12 €
Min.: 1
Mult.: 1
Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25erwartet ab 16.10.2026
12,76 €
11,53 €
11,25 €
Min.: 1
Mult.: 1
Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25erwartet ab 22.10.2026
14,26 €
13,26 €
Min.: 1
Mult.: 1
Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25erwartet ab 21.10.2026
16,89 €
15,82 €
Min.: 1
Mult.: 1
Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25erwartet ab 02.10.2026
10,04 €
9,00 €
8,50 €
8,32 €
Min.: 1
Mult.: 1
Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25erwartet ab 22.10.2026
19,34 €
17,38 €
Min.: 1
Mult.: 1
Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25erwartet ab 21.10.2026
10,79 €
9,68 €
9,13 €
8,97 €
Min.: 1
Mult.: 1
Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25erwartet ab 21.10.2026
11,06 €
9,94 €
9,69 €
Min.: 1
Mult.: 1
Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25erwartet ab 09.10.2026
11,78 €
10,60 €
10,35 €
Min.: 1
Mult.: 1
Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25erwartet ab 22.10.2026
21,29 €
20,15 €
Min.: 1
Mult.: 1
Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25erwartet ab 21.10.2026
11,98 €
10,78 €
10,52 €
Min.: 1
Mult.: 1
Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25erwartet ab 21.10.2026
24,63 €
23,48 €
Min.: 1
Mult.: 1
Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
22erwartet ab 21.10.2026
12,69 €
11,46 €
11,18 €
Min.: 1
Mult.: 1
Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25erwartet ab 22.10.2026
13,46 €
12,48 €
Min.: 1
Mult.: 1
Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25erwartet ab 22.10.2026
14,16 €
13,17 €
Min.: 1
Mult.: 1
Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25erwartet ab 02.10.2026
11,47 €
10,31 €
10,06 €
Min.: 1
Mult.: 1
Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25erwartet ab 14.10.2026
15,40 €
14,38 €
Min.: 1
Mult.: 1
Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
22erwartet ab 11.11.2026
15,55 €
14,52 €
Min.: 1
Mult.: 1
Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25erwartet ab 22.10.2026
18,16 €
17,08 €
Min.: 1
Mult.: 1
Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25erwartet ab 21.10.2026
20,32 €
18,29 €
Min.: 1
Mult.: 1
Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25erwartet ab 22.10.2026
20,35 €
19,24 €
Min.: 1
Mult.: 1
Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25erwartet ab 21.10.2026
25,56 €
24,40 €
Min.: 1
Mult.: 1
Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25erwartet ab 22.10.2026
26,50 €
25,34 €
Min.: 1
Mult.: 1
Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25erwartet ab 22.10.2026
27,59 €
26,43 €
Min.: 1
Mult.: 1
Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket Nicht-auf-Lager-Vorlaufzeit 10 Wochen
11,82 €
Min.: 350
Mult.: 1
Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6