MicroSpeed Triple High-Speed Connectors

TE Connectivity's ERNI MicroSpeed Triple High-Speed Connectors are ideally suited for next-generation communication standards such as Next Generation Ethernet 100Gbit/s (IEEE 802.3ba), optical internetworking forum (OIF), and the Internet of Things (loT). These shielded, high-density connectors utilize three rows to enable data rates of up to 25Gbit/s. They have SMT terminals that provide a high contact density with 3 x 25 positions in a 1mm pitch. Applications for TE Connectivity's ERNI MicroSpeed Triple High-Speed Connectors include data communication and telecommunication, high-end computing, medical technology, and industrial automation.

Ergebnisse: 2
Auswählen Bild Teile-Nr. Herst. Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern. Menge RoHS ECAD Model Produkt Anzahl der Positionen Abstand Anzahl der Zeilen Montage Montagewinkel Stackhöhe Nennstrom Kontaktüberzug Serie Verpackung
TE Connectivity / ERNI Platine-zu-Platine & Mezzanine-Steckverbinder MSPEED 75 M SMD M1 BE ABC VVV 137 176 * Nicht-auf-Lager-Vorlaufzeit 15 Wochen
Min.: 450
Mult.: 450
Rolle: 450

Connectors 75 Position 1 mm (0.039 in) 3 Row Solder Vertical 1 mm 1 A Gold MicroSpeed Reel
TE Connectivity / ERNI Platine-zu-Platine & Mezzanine-Steckverbinder MSPEED 75 F SMD F4 BE ABC VVV 137 176 * Nicht-auf-Lager-Vorlaufzeit 15 Wochen
Min.: 550
Mult.: 550
Rolle: 550

Connectors 75 Position 1 mm (0.039 in) 3 Row Solder Vertical 4 mm 1 A Gold MicroSpeed Reel