900 Series Elliptical Fin Heat Sinks

Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.

Ergebnisse: 145
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Menge RoHS ECAD Model Produkt
Bestimmt für
Montageart
Wärmeableitmaterial
Lamellenart
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Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Pin Fin, 23mm Chip Size, 14.6mm Height, Aluminum
Datenblatt
335Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 23mm Clip Aluminum Elliptical Pin 23 mm 23 mm 14.6 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Pin Fin, 35mm Chip Size, 22.6mm Height, Aluminum
Datenblatt
245Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 35mm Clip Aluminum Elliptical Pin 35 mm 35 mm 22.65 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Pin Fin, 31mm Chip Size, 14.6mm Height, Aluminum
Datenblatt
33Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 31mm Clip Aluminum Pin Fin
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Pin Fin, 35mm Chip Size, 17.6mm Height, Aluminum
Datenblatt
106Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 35mm Clip Aluminum Elliptical Pin 35 mm 35 mm 17.6 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Pin Fin, 21mm Chip Size, 14.6mm Height, Aluminum
Datenblatt
240Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 21mm Clip Aluminum Elliptical Pin 21 mm 21 mm 20.6 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Elliptical, 19mm Chip Size, 11.6mm Height, Aluminum
Datenblatt
265Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 19mm Clip Aluminum Pin Fin 19 mm 19 mm 11.6 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Pin Fin, 27mm Chip Size, 11.6mm Height, Aluminum
Datenblatt
235Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 27mm Clip Aluminum Elliptical Pin 27 mm 27 mm 11.6 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Elliptical, 31mm Chip Size, 22.6mm Height, Aluminum
Datenblatt
253Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 31mm Clip Aluminum Pin Fin 31 mm 31 mm 22.65 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Pin Fin, 40mm Chip Size, 22.6mm Height, Aluminum
Datenblatt
174Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 40mm Through Hole Aluminum Elliptical Pin 40 mm 40 mm 22.65 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Elliptical, 19mm Chip Size, 22.6mm Height, Aluminum
Datenblatt
202Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 19mm Clip Aluminum Pin Fin 19 mm 19 mm 22.65 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Pin Fin, 19mm Chip Size, 11.6mm Height, Aluminum
Datenblatt
35Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 19mm Clip Aluminum Elliptical Pin 19 mm 19 mm 11.6 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Pin Fin, 21mm Chip Size, 11.6mm Height, Aluminum
Datenblatt
160Auf Lager
310Auf Bestellung
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 21mm Clip Aluminum Elliptical Pin 21 mm 21 mm 11.6 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Pin Fin, 21mm Chip Size, 22.6mm Height, Aluminum
Datenblatt
71Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 21mm Clip Aluminum Elliptical Pin 21 mm 21 mm 22.65 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Elliptical, 27mm Chip Size, 11.6mm Height, Aluminum
Datenblatt
212Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 27mm Clip Aluminum Pin Fin 27 mm 27 mm 11.6 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Elliptical, 27mm Chip Size, 22.6mm Height, Aluminum
Datenblatt
141Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 27mm Clip Aluminum Pin Fin 27 mm 27 mm 22.65 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Pin Fin, 27mm Chip Size, 22.6mm Height, Aluminum
Datenblatt
76Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 27mm Clip Aluminum Elliptical Pin 27 mm 27 mm 22.65 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Elliptical, 31mm Chip Size, 11.6mm Height, Aluminum
Datenblatt
45Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 31mm Clip Aluminum Elliptical 31 mm 31 mm 11.6 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Pin Fin, 35mm Chip Size, 11.6mm Height, Aluminum
Datenblatt
47Auf Lager
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 35mm Clip Aluminum Elliptical Pin 35 mm 35 mm 11.6 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Pin Fin, 19mm Chip Size, 22.6mm Height, Aluminum
Datenblatt
359erwartet ab 05.06.2026
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 19mm Clip Aluminum Pin Fin 19 mm 19 mm 22.65 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Pin Fin, 40mm Chip Size, 11.6mm Height, Aluminum
Datenblatt
128erwartet ab 13.05.2026
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 40mm Through Hole Aluminum Elliptical Pin 40 mm 40 mm 11.6 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Elliptical, 19mm Chip Size, 17.6mm Height, Aluminum
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 19mm Clip Aluminum Omnidirectional Fin 19 mm 19 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Elliptical, 19mm Chip Size, 14.6mm Height, Aluminum
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 19mm Clip Aluminum Omnidirectional Fin 19 mm 19 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Elliptical, 19mm Chip Size, 20.6mm Height, Aluminum
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 19mm Clip Aluminum Omnidirectional Fin 19 mm 19 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Elliptical, 19mm Chip Size, 27.6mm Height, Aluminum
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 19mm Clip Aluminum Omnidirectional Fin 19 mm 19 mm
Wakefield Thermal Wärmeableitungen Chipset Heat Sink with Clip, Elliptical, 19mm Chip Size, 32.6mm Height, Aluminum
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 19mm Clip Aluminum Omnidirectional Fin 19 mm 19 mm