Winbond Serial MCP Flash Portfolio with SpiStack®

Winbond Serial MCP Flash Portfolio with SpiStack® is based on the W25Q/W25N SpiFlash® series by stacking W25Q16JV and W25N01GV. The portfolio offers flexible memory density and reliability combinations for the low pin count package and Concurrent Operations in Serial Flash memory for the first time. Winbond W25M SpiStack series is ideal for small form factor system designs and applications that demand high Program/Erase data throughput. The series comprises a 1.8V NAND Flash Memory device and a 1.8V Low Power SDRAM device. MCP is an all-in-one package that provides an effective solution for saving Printed Circuit Board (PCB) space. This benefit becomes more critical in small PCBs for modules and space-critical designs, particularly for mobile and portable applications.

Winbond offers SpiStack W25M Memory Series for stacking homogeneous or heterogeneous flash. This achieves memory of varying densities for code and data storage while providing flash solutions to meet design requirements. SpiStack architecture offers designers maximum flexibility in tailoring flash solutions to meet specific memory density and application requirements. The W25M Series provides a wide range of densities in the well-established 8-pin package to which designers are accustomed. W25M memories also feature the multi-IO SpiFlash interface, featuring SPI and command set.

Features

W25M SpiStack
- Stack flash dies to form a higher-density part of the choice
- Users can select based on specific density requirement
- SPI
- Backward compatible with existing SpiFlash
Homogeneous stacking – Two or more dies
- NOR dies combined using 1Mb to 256Mb dies
- NAND dies combined using 512Mb to 2Gb dies

Heterogeneous stacking – two or more dies
- NOR and NAND dies stacked together
Concurrent operation
- Read operation on one die
- Write/Erase operation on another die + Code execution not interrupted for data updates