Weintek M02 Wi-Fi® Module

Weintek M02 Wi-Fi® Module offers flexible networking options, ideal for mobile equipment and hard-to-wire environments. This Wi-Fi module features a modular design and adds wireless connectivity to HMI. The M02 Wi-Fi module is a compact design and little protrusion when installed on HMI, which avoids space issues in control cabinet installation. This Wi-Fi 802.11 module is used with the cMT2108X2 and cMT3102X panels. The M02 module operates at 5VDC input power, 500VAC (1 minute) voltage resistance, and 0°C to 55°C operating temperature range. This Wi-Fi module is available in 54.5mm x 80mm x 24.1mm (WxHxD) dimensions. The M02 Wi-Fi Module is cULus Listed and IP20/IP66 rated. This module is ideal for wireless HMI access, mobile monitoring, hotspot mode, and cloud integration.

Features

  • Modular design adds wireless connectivity to HMIs to help overcome wiring obstacles
  • WiFi standards supported include IEEE 802.11b/g/n
  • Compact design and little protrusion when installed on HMI, which avoids space issues in control cabinet installation
  • Magnetic external antenna is installed at the location with optimal signal

Applications

  • Wireless HMI access
  • Mobile monitoring
  • Hotspot mode
  • Cloud integration

Specifications

  • Network:
    • Wi-Fi:
      • IEEE 802.11 b/g/n
      • 802.11b maximum 19.76dBm
      • 802.11g maximum 19.93dBm
      • 802.11n maximum 19.99dBm
  • Power:
    • 900mA @5VDC (powered by HMI) power consumption
    • 500VAC (1minute) volatge resistance
    • Exceed 50MΩ at 500VDC isolation resistance
  • 54.5mm x 80mm x 24.1mm dimensions (WxHxD)
  • Environment:
    • Protection structure:
      • M02 IP20 compliant
      • Antenna IP66 compliant
  • 0°C to 55°C (32°F to 131°F) operating temperature range
  • 10% to 90% (non-condensing) relative humidity
  • 10Hz to 25Hz (X, Y, and Z direction 2G 30 minutes) vibration endurance
  • CE and UL certified

Installation Overview

Weintek M02 Wi-Fi® Module

Dimensions

Mechanical Drawing - Weintek M02 Wi-Fi® Module
Veröffentlichungsdatum: 2025-08-13 | Aktualisiert: 2025-10-30