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Molex DDR4 miniDIMM-Sockel

Der Molex DDR4 miniDIMM-Sockel erreicht noch nie dagewesene Platzeinsparungen auf der Leiterplatte im Computerbereich und bei Netzwerkspeicheranwendungen. Die Sockel mit einem Rastermaß von 0,60mm erfüllen die JEDEC-Standards. Anwendungen umfassen PCs und Server mit kleinem Formfaktor einschließlich 1U- und Blade-Server.

Merkmale

  • Small form factor design (approximately 2/3 smaller than standard DDR4 DIMM sockets)
  • Metal grips on the housing towers (patent pending) reduce shock or vibration to the mounted memory modules during transit
  • Latches that can withstand at least 25 mating cycles provide high durability in mission-critical applications
  • Profiled contacts with high normal force and excellent contact reliability
  • Designed to withstand two reflow cycles and ensures optimal performance under heat
  • Pick-and-place cap option for automated processing
  • Halogen-free and RoHS compliant

Applikationen

  • Data/computing
    • High-end computing
    • Personal computers
    • RAID/storage
  • Telecommunications/networking
    • Infrastructure
    • Network operations center

Technische Daten

  • Electrical
    • 29VAC(RMS)/DC maximum voltage
    • 0.75A maximum current per pin
    • Low-level contact resistance
      • 20mΩ for 151105 components
      • 25mΩ for 151134 components
    • 500VAC dielectric withstanding voltage
    • 1MΩ minimum insulation resistance
  • Mechanical
    • 150.0N maximum module insertion force with latches
    • 3.6kgf minimum module rip-out force
    • 25N maximum insertion force to PCB
    • Minimal terminal retention force
      • 300gf per pin
      • 8.0N per forklock
    • 35N maximum latch actuation force per latch
    • 25 cycle durability
  • -55°C to +85°C operating temperature range
  • For use with JEDEC MO-309 memory modules
  • Materials
    • UL 94V-0, black, glass-filled LCP housing
    • UL 94V-0, black, glass-filled polyamide latch
    • Copper alloy contacts
    • Plating
      • 0.76µ Gold (Au) over 1.25µ Nickel (Ni) in the contact area
      • 2.54µ Tin (Sn) over 1.25µ Nickel (Ni) in the soldertail area
      • 2.54µ Tin (Sn) over 1.25µ Nickel (Ni) for the PCB hold-down

Videos

Veröffentlichungsdatum: 2015-09-16 | Aktualisiert: 2022-03-11