Laird Technologies Tflex SF4 Thermal Gap Fillers
Laird Technologies Tflex SF4 Thermal Gap Fillers are silicon-free and offer a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity. These gap fillers provide products with excellent deflection properties, providing minimal pressure on components during deflection. A minimal amount of pressure is required to reach the lowest possible thermal resistance. Laird Technologies Tflex SF4 Thermal Gap Fillers are designed for datacom systems, automotive electronics, optical modules, and cameras.
Features
- Silicone-free formulation
- Low peak and residual pressure
- Excellent surface wetting for low contact resistance
- Exceptionally low thermal resistance
- UL V-0 flammability rating
Applications
- Datacom systems
- Automotive electronics
- Telecom systems
- Optical modules
- Cameras
Specifications
- Light gray coloring
- 0.5mm to 4mm thickness range
- 4W/mK thermal conductivity
- -65°C to +150°C operating temperature range
- 3.1g/cc density
- 7.5kV/mm dielectric breakdown voltage
- 6 x 10^13 volume resistivity
- Shelf life
- 2 years from date of shipment
- No change for materials with DF, 1 year for all products with adhesive
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Laird Technologies Tflex SF7 Thermal Gap Fillers
Innovative, high-performing thermal material with silicone-free construction.
Veröffentlichungsdatum: 2024-09-05
| Aktualisiert: 2025-06-17