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Espressif Systems ESP32-H2FHxS SMD BLUETOOTH® SoCs

Espressif Systems ESP32-H2FHxS SMD BLUETOOTH® System-on-Chips (SoCs) are highly integrated wireless microcontrollers designed for low-power, high-performance connectivity in embedded applications. Built around a 32-bit RISC-V processor, these compact SMD devices support Bluetooth Low Energy (LE) 5.3 and IEEE 802.15.4 for Thread and Zigbee protocols, enabling robust mesh networking and seamless device communication.

The Espressif Systems ESP32-H2FHxS SoCs include 320KB SRAM, 128KB ROM, and 4MB embedded flash, offering ample memory for complex applications. Integrated peripherals include a 12-bit Analog-to-Digital Converter (ADC), temperature sensor, and a full-speed USB interface, while the built-in RF balun simplifies PCB design and reduces BOM cost. Advanced security features such as ECC, RSA, AES, SHA, and secure boot ensure reliable protection for connected systems.

With the small 4mm x 4mm footprint, low power consumption, and versatile wireless capabilities, the ESP32-H2FHxS components are ideal for smart home devices, industrial automation, wearables, and battery-powered Internet of Things (IoT) nodes. Users benefit from Espressif’s mature software ecosystem and extensive documentation, making it easier to bring secure, scalable products to market.

Features

  • Bluetooth
    • Bluetooth Low Energy (Bluetooth 5.3 certified)
    • Bluetooth mesh
    • Bluetooth Low Energy long range (coded PHY, 125Kbps and 500Kbps)
    • Bluetooth Low Energy high speed (2Mbps)
    • Bluetooth Low Energy advertising extensions and multiple advertising sets
    • Simultaneous operation of broadcaster, observer, central, and peripheral devices
    • Multiple connections
    • LE power control
  • 802.15.4
    • IEEE Standard 802.15.4-2015 compliant
    • Supports 250Kbps data rate in the 2.4GHz band and OQPSK PHY
    • Supports Thread
    • Supports Zigbee 3.0
    • Supports Matter
    • Supports other application-layer protocols (HomeKit, MQTT, etc)
  • CPU and memory
    • 32-bit RISC-V single-core processor
    • Up to 96MHz clock speed
    • CoreMark® score - at 96MHz: 303.38 CoreMark; 3.16 CoreMark/MHz
    • 4-stage pipeline
    • 128KB ROM (TCM)
    • 320KB SRAM (TCM)
    • 4KB LP memory
    • 2MB or 4MB in-package flash
    • 16KB cache
    • SPI, Dual SPI, Quad SPI, and QPI interfaces allow connection to flash and other SPI devices
    • Flash in-Circuit Programming (ICP)
  • 19x programmable GPIOs - GPIO8, GPIO9, and GPIO25 are the three strapping pins
  • Digital interfaces
    • 2x SPI ports for communication with flash
    • General-purpose SPI port
    • 2x UART
    • 2x I2C
    • I2S
    • RMT, with up to 2x transmit channels and 2x receive channels
    • Pulse count controller
    • LED PWM controller, up to 6x channels
    • USB Serial/JTAG controller
    • Motor Control PWM (MCPWM)
    • General DMA controller, with 3x transmit channels and 3x receive channels
    • TWAI® controller, compatible with ISO 11898-1 (CAN Specification 2.0)
    • SoC event task matrix (ETM)
    • Parallel IO (PARLIO) controller
  • Analog interfaces
    • 12-bit SAR ADC with up to 5x channels
    • Temperature sensor
  • Timers
    • 2x 54-bit general-purpose timers
    • 52-bit system timer
    • 3x watchdog timers
  • Power management
    • Fine-resolution power control through a selection of clock frequency, duty cycle, RF operating modes, and individual power control of internal components
    • 4x power modes designed for typical scenarios - Active, Modem-sleep, Light-sleep, and Deep-sleep
    • 7µA power consumption in Deep-sleep mode
    • LP memory remains powered on in Deep-sleep mode
  • Security
    • Secure boot - ensuring firmware integrity
    • Flash encryption - memory encryption and decryption
    • 4096-bit OTP, up to 1792 bits for users
    • Cryptographic hardware acceleration
      • AES-128/256 (FIPS PUB 197) - ECB/CBC/CFB/OFB/CTR (FIPS PUB 800-38A)
      • SHA accelerator (FIPS PUB 180-4)
      • RSA accelerator
      • ECC accelerator
      • ECDSA (Elliptic Curve Digital Signature Algorithm)
      • HMAC
      • Digital signature
    • Access Permission Management (APM)
    • Random Number Generator (RNG)
    • Power glitch detector
  • RF module
    • Antenna switches, RF balun, power amplifier, and low-noise receive amplifier
    • Up to -106.5dBm of sensitivity for Bluetooth LE receiver (125Kbps)
    • Up to -102.5dBm of sensitivity for 802.15.4 receiver (250Kbps)
  • 4mm x 4mm QFN32 package
  • -40°C to +105°C operating temperature range

Applications

  • Smart homes
  • Industrial automation
  • Health care
  • Consumer electronics
  • Smart agriculture
  • Matter solutions
  • Service robots
  • Generic low-power IoT sensor hubs and data loggers

Functional Block Diagram

Block Diagram - Espressif Systems ESP32-H2FHxS SMD BLUETOOTH® SoCs

Power Scheme

Mechanical Drawing - Espressif Systems ESP32-H2FHxS SMD BLUETOOTH® SoCs

Address Mapping Structure

Mechanical Drawing - Espressif Systems ESP32-H2FHxS SMD BLUETOOTH® SoCs
Veröffentlichungsdatum: 2025-09-23 | Aktualisiert: 2026-01-05