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congatec conga-TC670 COM Express Type 6 Compact Modules

congatec conga-TC670 COM Express Type 6 Compact Modules are based on the 12th Gen Intel® Core™ embedded mobile processors (code name "Alder Lake"). These modules feature an Intel® hybrid design that combines Performance-cores with Efficient–cores. An Intel® Iris® Xe Graphics® architecture offers up to 96 Execution Units (EUs). The conga-TC670 COM Express Type 6 Compact Modules provide ACPI 6.0 power management with battery support, Trusted Platform Module (TPM 2.0) security, 2.5GbE TSN Ethernet (vial Intel® i225 LM), and great scalability. The 95mm2 congatec conga-TC670 COM Express Type 6 Compact Modules are for use with power-optimized applications.

Features

  • Intel® hybrid design combines performance cores with efficient cores
  • Intel® Iris® Xe Graphics® architecture with up to 96 EUs
  • PCI Express Gen 4, USB 3.2
  • AI acceleration with Intel® Deep Learning Boost (VNNI)
  • Embedded use condition modules available

Specifications

  • COM Express Compact form factor
  • CPUs
    • Intel® Core™ i7-12800HE (6x 2.4GHz, 24MB cache, 45W)
    • Intel® Core™ i5-12600HE (4x 2.5GHz, 18MB cache, 45W)
    • Intel® Core™ i3-12300HE (4x 1.9GHz, 12MB cache, 45W)
  • 2x SO-DIMM sockets for DDR5 memory modules up to 32GByte each (maximum 64GByte system capacity), up to 4800 MT/s
  • 2.5GbE TSN Ethernet (vial Intel® i225 LM)
  • I/O interfaces
    • 8x PCIe Gen4 PEG
    • Up to 8x PCIe Gen3
    • 8x USB (up to 4x USB 3.2, up to 8x USB 2.0)
    • Up to 2x SATA
    • Up to 2x UART
    • CAN (opt.)
    • GPIOs
    • SPI
    • LPC bus
    • SM-Bus
    • I2C bus
  • NVMe x4 SSD (optional) mass storage
  • Intel® UHD Graphics or Intel® Iris® Xe Graphics architecture, up to 96 EUs
  • Congatec board controllers
    • Multi-stage watchdog
    • Non-volatile user data storage
    • Manufacturing and board information
    • Board statistics
    • I2C bus (fast mode, 400kHz, multi-master)
    • Power loss control
    • Hardware health monitoring
    • POST code redirection
  • Embedded BIOS
    • AMI Aptio UEFI
    • 32MByte serial SPI firmware flash
    • OEM Logo
    • OEM CMOS defaults
    • LCD control
    • Display auto-detection
    • Backlight control
    • Flash update
  • Trusted Platform Module (TPM 2.0) for security
  • ACPI 6.0 power management with battery support
  • Operating systems
    • Microsoft® Windows 11
    • Microsoft® Windows® 10
    • Microsoft® Windows 10 IoT Enterprise
    • Linux
    • Yocto
    • RTS Hypervisor
  • Temperature ranges
    • Commercial
      • 0 to +60°C operating
      • -20°C to +70°C storage
    • -40°C to +85°C industrial
  • Video interfaces
    • 3x DDI (up to 5K support)
    • LVDS (optional eDP)
    • VGA (optional)
  • 95mm2 in dimension

Block Diagram

Block Diagram - congatec conga-TC670 COM Express Type 6 Compact Modules

Related Thermal Management

Veröffentlichungsdatum: 2022-01-07 | Aktualisiert: 2024-03-05