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MicroStrain by HBK G-Link-200-OEM Wireless Accelerometer Nodes

MicroStrain by HBK G-Link-200-OEM Embeddable Wireless Accelerometer Nodes feature an onboard triaxial accelerometer that allows high-resolution data acquisition with extremely low noise and drift. Derived vibration parameters allow for long-term monitoring of key performance indicators while maximizing battery life. The G-Link-200-OEM embeddable wireless accelerometer nodes enable simultaneous, high-speed sensing and data aggregation from scalable sensor networks. MicroStrain's wireless sensing systems are ideal for test and measurement, remote monitoring, system performance analysis, and embedded applications.

G-Link-200-OEM inputs are 20-bit resolution with ±0.1% full-scale measurement accuracy. The nodes log data to internal memory, transmit real-time synchronized data, and support event-driven triggers with both pre-and post-event buffers. Users can easily program nodes for continuous, periodic burst, or event-triggered sampling with the SensorConnect software. The optional web-based SensorCloud interface optimizes data aggregation, analysis, presentation, and alerts for sensor data from remote networks.

The -CE parts are certified for use in the EU, and the -JPN parts are certified for use in Japan.

Features

  • High-performance sensing
    • Onboard triaxial accelerometer with ±2g to ±40g measurement range
    • Extremely low noise on all axes, 25µg/√Hz or 80µg/√Hz
    • User-configurable low and high pass filters
    • Onboard temperature sensor
  • Easy to integrate
    • Small, thin form factor
    • Power from 3.3VDC to 36VDC
    • -40°C to +85°C operating temperature range
    • Onboard, U.FL, or MMCX antenna options
  • Reliable data collection
    • Lossless, synchronized, and scalable networks using the LXRS or LXRS+ protocol
    • Remotely configure nodes and view sensor data with SensorConnect (PC), SensorCloud (web), or MSCL (API library)
  • Configurable for many applications
    • Output raw acceleration waveform data, tilt, or derived vibration parameters (Velocity, Amplitude, Crest Factor)
    • Up to 4096Hz sampling
    • Continuous, periodic, or event-triggered operation
    • Transmit data in real-time and/or save to onboard memory

Applications

  • Vibration monitoring
  • Health monitoring of rotating components, aircraft, structures, and vehicles
  • Condition-based maintenance (CBM)
  • Impact and event monitoring

Specifications

  • Analog input channels
    • Measurement ranges
      • 8g - ±2g, ±4g, or ±8g configurable
      • 40g - ±10g, ±20g, or ±40g configurable
    • Noise density
      • 25µg/√Hz for 8g
      • 80µg/√Hz for 40g
    • 0g offset
      • ±25mg (±2g) for 8g
      • ±50mg (±10g) for 40g
    • 0g offset vs. temperature
      • ±0.15mg/°C maximum for 8g, ±0.1mg/°C typical
      • ±0.75mg/°C maximum for 40g, ±0.5mg/°C typical
    • Triaxial integrated MEMS accelerometer, 3x channels
    • DC to 1kHz accelerometer bandwidth
    • 20-bit resolution
    • <1% scale factor error
    • 1% typical cross-axis sensitivity
    • ±0.01%/°C typical sensitivity change (temperature)
    • 1.5kHz anti-aliasing filter (-6dB attenuation)
    • 26Hz to 800Hz configurable low-pass digital filter
    • Off to 2.5Hz configurable high-pass digital filter
  • Sampling
    • Continuous, periodic burst, and event-triggered sampling modes
    • Acceleration, tilt, and derived channels output options
      • Velocity (IPSRMS)
      • Amplitude (GRMS and Gpk-pk)
      • Crest factor
    • 1x sample/hour to 4096Hz
    • ±5ppm sample rate stability
    • Up to 128x nodes per RF channel network capacity
    • ±50µs node synchronization
    • 16M Bytes  data storage capacity (up to 8 million data points)
  • Integrated temperature channel
    • -40°C to +85°C measurement range
    • ±0.25°C accuracy (over full range)
  • Operating parameters
    • Wireless communication ranges
      • 2km ideal outdoor/line-of-sight distance, 800m typical
      • 1km ideal onboard antenna distance, 400m typical
      • 50m typical distance for indoor/obstructions
    • Surface mount antenna or external antenna through an MMCX or U.FL connector
    • License-free 2.405GHz to 2.480GHz radio frequency (RF) transceiver carrier with 16x channels
    • User-adjustable 0dBm to 20dBm transmit power, restricted regionally
    • 3.3VDC to 36VDC power source to solder pads
    • Pulse current ranges
      • 45mA to 135mA at +20dBm Tx power
      • 32mA to 100mA at +16dBm Tx power or less
    • ±4000V ESD (applies to VIN, GND, antenna, and shield)
    • 1000g/1.5ms mechanical shock limit
  • Physical
    • 38.1mm x 29.0mm x 6.5mm (1.5" x 1.14" x 0.254") size
    • Humiseal 1B31 conformal coating
  • Integration
    • All WSDA gateways are compatible
    • SensorCloud, SensorConnect, Windows® 7, 8, & 10 software compatible
    • FCC (USA), IC (Canada), CE (European Union), and MIC (Japan) regulatory compliance

Accessories

Resources

Electrical Block Diagram

Block Diagram - MicroStrain by HBK G-Link-200-OEM Wireless Accelerometer Nodes

Antenna Options

Infographic - MicroStrain by HBK G-Link-200-OEM Wireless Accelerometer Nodes

Dimensions

Mechanical Drawing - MicroStrain by HBK G-Link-200-OEM Wireless Accelerometer Nodes

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Compatible With

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Veröffentlichungsdatum: 2025-08-26 | Aktualisiert: 2025-09-02