Multiprotokoll-Module

Ergebnisse: 1.631
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Menge RoHS ECAD Model Serie
Frequenz
Ausgangsleistung
Schnittstellen-Typ
Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Antennenanschlusstyp
Abmessungen
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – Mobilfunk, NBIoT, LTE
Protokoll – GPS, GLONASS
Protokoll – Sub-GHz
Protokoll – WLAN – 802.11
Protokoll – ANT, Thread, Zigbee – 802.15.4
Qualifikation
Verpackung
Ezurio Multiprotokoll-Module Module, BL54H20, Bluetooth LE, MHF4, Tape and Reel
Datenblatt
986erwartet ab 21.10.2026
Min.: 1
Mult.: 1
: 1.000

BL54H20 UART 1.71 V 1.98 V - 40 C + 105 C MHF4 13.5 mm x 10 mm x 1.8 mm Bluetooth 5.4 802.15.4 Reel, Cut Tape
Ezurio Multiprotokoll-Module Module, BL54L15, Bluetooth LE, Chip Antenna, Cut Tape
Datenblatt
1.544erwartet ab 02.12.2026
Min.: 1
Mult.: 1

BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Cut Tape
Ezurio Multiprotokoll-Module Module, BL54L15, Bluetooth LE, Chip Antenna, Tape and Reel
Datenblatt
1.000erwartet ab 05.11.2026
Min.: 1
Mult.: 1
: 1.000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Ezurio Multiprotokoll-Module Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Cut Tape
Datenblatt
220erwartet ab 21.09.2026
Min.: 1
Mult.: 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Multiprotokoll-Module Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, Cut Tape
Datenblatt
250erwartet ab 21.09.2026
Min.: 1
Mult.: 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Multiprotokoll-Module Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, Cut Tape
Datenblatt
250erwartet ab 21.09.2026
Min.: 1
Mult.: 1
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Kaga FEI Multiprotokoll-Module WLAN module for NXP IW611. WiFi 6 1x1 dual band, BT, BLE 5.4
Datenblatt
300erwartet ab 17.11.2026
Min.: 1
Mult.: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
Kaga FEI Multiprotokoll-Module WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
Datenblatt
300erwartet ab 17.11.2026
Min.: 1
Mult.: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
Insight SiP Multiprotokoll-Module nRF52832 LoRa Transceiver & BLE 5 Module US
Datenblatt
1.092Auf Bestellung
Min.: 1
Mult.: 1
902 MHz to 928 MHz, 2.4 GHz 22 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0
GigaDevice Multiprotokoll-Module RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC / onboard PCB antenna
Datenblatt
800erwartet ab 20.11.2026
Min.: 1
Mult.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 105 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi
GigaDevice Multiprotokoll-Module RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
Datenblatt
800erwartet ab 01.01.2027
Min.: 1
Mult.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice Multiprotokoll-Module RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
Datenblatt
800erwartet ab 01.01.2027
Min.: 1
Mult.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
u-blox Multiprotokoll-Module Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip
Datenblatt
250erwartet ab 12.10.2026
Min.: 1
Mult.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Multiprotokoll-Module Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
Datenblatt
750erwartet ab 31.12.2026
Min.: 1
Mult.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Multiprotokoll-Module IW611, 802.11ax+BT, 2 antenna pins
Datenblatt
1.000erwartet ab 17.08.2026
Min.: 1
Mult.: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Multiprotokoll-Module Host-based dual-band Wi-Fi 6 and Bluetooth LE module for IoT, 1 antenna pin
Datenblatt
500erwartet ab 31.12.2026
Min.: 1
Mult.: 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 15 dBm, 18 dBm SPI, UART, USB 3.13 VDC 3.46 VDC - 40 C + 85 C Pin 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Microchip Technology Multiprotokoll-Module Wi-Fi + Bluetooth LE Module, Chip Antenna
Datenblatt
500erwartet ab 12.08.2026
Min.: 1
Mult.: 1
: 500

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Texas Instruments Multiprotokoll-Module SimpleLink multipro tocol 2.4-GHz wirele
Datenblatt
1.900erwartet ab 14.12.2026
MouseReel verfügbar
Min.: 1
Mult.: 1
: 2.000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
Texas Instruments Multiprotokoll-Module SimpleLink multipro tocol 2.4-GHz wirele
Datenblatt
232Auf Lager
2.000erwartet ab 03.09.2026
MouseReel verfügbar
Min.: 1
Mult.: 1
: 2.000

CC2652RSIP 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External 7 mm x 7 mm BLE ISM Thread, Zigbee Reel, Cut Tape, MouseReel
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
1.070erwartet ab 04.09.2026
Min.: 1
Mult.: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape

Silicon Labs Multiprotokoll-Module Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm
Datenblatt
1.300erwartet ab 11.08.2026
Min.: 1
Mult.: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Silicon Labs Multiprotokoll-Module SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package?
Datenblatt
200Auf Bestellung
Min.: 1
Mult.: 1

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
Telit Cinterion Multiprotokoll-Module
387erwartet ab 27.08.2026
Min.: 1
Mult.: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm NBIoT, LTE GPS, GLONASS Tray
Embedded Artists Multiprotokoll-Module 2GF M.2 Module
Datenblatt
45erwartet ab 30.10.2026
Min.: 1
Mult.: 1

2.4 GHz to 5 GHz 4-Wire UART, SDIO 3.15 V 3.46 V - 20 C + 70 C u.FL 802.11 a/b/g/n/ac Bulk
Embedded Artists Multiprotokoll-Module 2FY M.2 Module
Datenblatt
49Auf Bestellung
Min.: 1
Mult.: 1

2.4 GHz to 2.484 GHz 9 dBm Audio, SDIO, UART 3.15 V 3.46 V - 40 C + 85 C U.FL Bluetooth 5.0 802.11a/b/g/n/ac/ax, 6/6E Bulk