Multiprotokoll-Module

Ergebnisse: 248
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Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Serie
Frequenz
Ausgangsleistung
Schnittstellen-Typ
Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Antennenanschlusstyp
Abmessungen
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – Mobilfunk, NBIoT, LTE
Protokoll – GPS, GLONASS
Protokoll – Sub-GHz
Protokoll – WLAN – 802.11
Protokoll – ANT, Thread, Zigbee – 802.15.4
Verpackung
Espressif Systems Multiprotokoll-Module SMD module, ESP32-S3, 4 MB SPI flash, PCB antenna
Datenblatt
3.771Auf Lager
18.200Auf Bestellung
Min.: 1
Mult.: 1

2.4 GHz 20.5 dBm I2C, I2S, SPI, PWM, UART, USB 3 V 3.6 V - 40 C + 85 C PCB 25.5 mm x 18 mm x 3.1 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems Multiprotokoll-Module SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 16 MB SPI flash, IPEX antenna connector.
Datenblatt
5.768Auf Lager
5.850erwartet ab 14.09.2026
Min.: 1
Mult.: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems Multiprotokoll-Module SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 4 MB SPI flash, PCB antenna
Datenblatt
2.342Auf Lager
1.950Auf Bestellung
Min.: 1
Mult.: 1

2.4 GHz 20.5 dBm I2C, I2S, SPI, PWM, UART, USB 3 V 3.6 V - 40 C + 85 C PCB 25.5 mm x 18 mm x 3.1 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems Multiprotokoll-Module SMD module, ESP32-S3R8 with 8 MB Octal PSRAM die inside, 4 MB Quad SPI flash, PCB antenna
Datenblatt
3.655Auf Lager
1.950Auf Bestellung
Min.: 1
Mult.: 1

2.4 GHz 20.5 dBm I2C, I2S, SPI, PWM, UART, USB 3 V 3.6 V - 40 C + 65 C PCB 25.5 mm x 18 mm x 3.1 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems Multiprotokoll-Module SMD module, ESP32-S3, 16 MB SPI flash, IPEX antenna connector
Datenblatt
449Auf Lager
4.550erwartet ab 20.11.2026
Min.: 1
Mult.: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems Multiprotokoll-Module SMD module, ESP32-S3, 16 MB SPI flash, PCB antenna
Datenblatt
3.733Auf Lager
3.250Auf Bestellung
Min.: 1
Mult.: 1

2.4 GHz 20.5 dBm I2C, I2S, SPI, PWM, UART, USB 3 V 3.6 V - 40 C + 85 C PCB 25.5 mm x 18 mm x 3.1 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems Multiprotokoll-Module SMD module, ESP32-S3, 4 MB SPI flash, IPEX antenna connector
Datenblatt
704Auf Lager
5.200erwartet ab 11.08.2026
Min.: 1
Mult.: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems Multiprotokoll-Module SMD Module ESP32-WROVER-E, ESP32-D0WD-V3, 3.3V 64Mbit PSRAM, 4 MB SPI flash, PCB Antenna
Datenblatt
3.117Auf Lager
6.500erwartet ab 21.09.2026
Min.: 1
Mult.: 1

ESP32-WROVER 2.4 GHz 20 dBm ADC, DAC, GPIO, I2C, I2S, PWM, SD Card, SDIO, SPI, TWAI, UART 3 V 3.6 V - 40 C + 85 C PCB 18 mm x 31.4 mm x 3.3 mm BLE, Bluetooth 4.2 802.11 b/g/n Tray
Espressif Systems Multiprotokoll-Module SMD Module ESP32-WROVER-IE, ESP32-D0WD-V3, 3.3V 64Mbit PSRAM, 4 MB SPI flash, IPEX connector
Datenblatt
3.182Auf Lager
Min.: 1
Mult.: 1

ESP32-WROVER 2.4 GHz 20 dBm I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C IPEX 18 mm x 31.4 mm x 3.3 mm BLE, Bluetooth 4.2 BR/EDR 802.11 b/g/n Tray
Microchip Technology Multiprotokoll-Module ATWILC3000 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna
Datenblatt
533Auf Lager
Min.: 1
Mult.: 1

2.4 GHz 18.5 dBm SDIO, SPI, UART 1.62 V 3.6 V - 40 C + 85 C u.FL 22.4 mm x 14.7 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Microchip Technology Multiprotokoll-Module b/g/n + Bluetooth 4 Module U.FL Antenna
Datenblatt
46Auf Lager
Min.: 1
Mult.: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Espressif Systems Multiprotokoll-Module SMD module, ESP32-S3R8 with 8 MB Octal PSRAM die inside, 4 MB Quad SPI flash, IPEX antenna connector
Datenblatt
193Auf Lager
6.500erwartet ab 20.08.2026
Min.: 1
Mult.: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 65 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Embedded Artists Multiprotokoll-Module 1ZM M.2 Wi-Fi 5 a/b/g/n/ac, Bluetooth 5.1 with 88W8987 chipset and LBEE5QD1ZM
Datenblatt
14Auf Lager
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 30 C + 85 C u.FL 22 mm x 44 mm Bluetooth 5.1 802.11 a/b/g/n/ac Bulk
Embedded Artists Multiprotokoll-Module 2AE M.2 Wi-Fi 5 a/b/g/n/ac, Bluetooth 5.2 with CYW4373E chipset and LBEE5PK2AE
Datenblatt
26Auf Lager
33erwartet ab 30.10.2026
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.5 V - 30 C + 85 C u.FL 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Ezurio Multiprotokoll-Module 60 Series, Sterling Module w/u.FL, USB/USB
Datenblatt
2Auf Lager
500Auf Bestellung
Min.: 1
Mult.: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm UART, USB 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray


Espressif Systems Multiprotokoll-Module Espressifs AWS IoT ExpressLink Module, pre-provisioned with required certificates and the ExpressLink firmware, for out-of-the-box connectivity to AWS IoT Core.
Datenblatt
124Auf Lager
1.300erwartet ab 11.08.2026
Min.: 1
Mult.: 1
2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 2.7 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 16.6 mm x 2.4 mm Bluetooth Bulk
Microchip Technology Multiprotokoll-Module Wi-Fi + Bluetooth LE Module,u.FL Antenna
Datenblatt
26Auf Lager
Min.: 1
Mult.: 1

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Microchip Technology Multiprotokoll-Module ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna
Datenblatt
22Auf Lager
Min.: 1
Mult.: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray

Silicon Labs Multiprotokoll-Module Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), MVP, 78 MHz, 10 dBm
Datenblatt
9Auf Lager
1.300erwartet ab 23.10.2026
Min.: 1
Mult.: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Embedded Artists Multiprotokoll-Module 1XK M.2 Wi-Fi 4 a/b/g/n, Bluetooth 5.2 with IW416 chipset and LBEE5CJ1XK module
Datenblatt
2Auf Lager
4Auf Bestellung
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.5 V - 40 C + 85 C Integrated 22 mm x 44 mm Bluetooth 5.2 802.11 b/g/n Bulk
Embedded Artists Multiprotokoll-Module 2BZ M.2 Wi-Fi 5 a/b/g/n/ac MIMO, Bluetooth 5.2 with CYW54590 and LBEE5XV2BZ
Datenblatt
3Auf Lager
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz UART, USB 3.3 V 3.6 V - 40 C + 85 C u.FL 22 mm x 30 mm x 1.5 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Silex Technology Multiprotokoll-Module [Bulk SKU] SX-PCEAX-HMC is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in a half-height Mini PCIe Card form factor. It is based on Qualcomm's QCA2066 chipset.
Datenblatt
503Auf Lager
Min.: 1
Mult.: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe 3.3 V 3.3 V - 20 C + 65 C 29.85 mm x 26.65 mm x 2.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Tray
Ezurio Multiprotokoll-Module SDIO 802.11a/b/g/n M2 Module and Bluetooth 4.0 UART
Datenblatt
8Auf Lager
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART 3.2 V 3.46 V - 30 C + 85 C RF 22 mm x 30 mm x 3.3 mm Bluetooth 4.0 802.11 a/b/g/n Tray
Quectel Multiprotokoll-Module Cat 4, 4Gbit ROM+2Gbit RAM, LTE only, Data only application, North America, mPCIe form factor
Datenblatt
89Auf Lager
Min.: 1
Mult.: 1

700 MHz to 960 MHz, 1.71 GHz to 2.69 GHz, 3.3 GHz to 5 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Tray
Embedded Artists Multiprotokoll-Module 1YN M.2 Wi-Fi 4 b/g/n, Bluetooth 5.2 with CYW43439 chipset and LBEE5KL1YN
Datenblatt
750erwartet ab 01.12.2026
Min.: 1
Mult.: 1

2.4 GHz 4-Wire UART, SDIO 3 V 3.5 V - 30 C + 85 C u.FL 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n Bulk