+ 85 C Multiprotokoll-Module

Ergebnisse: 610
Auswählen Bild Teile-Nr. Herst. Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern. Menge RoHS ECAD Model Serie Frequenz Ausgangsleistung Schnittstellen-Typ Versorgungsspannung - Min. Versorgungsspannung - Max. Minimale Betriebstemperatur Maximale Betriebstemperatur Antennenanschlusstyp Abmessungen Protokoll – Bluetooth, BLE – 802.15.1 Protokoll – Mobilfunk, NBIoT, LTE Protokoll – GPS, GLONASS Protokoll – Sub-GHz Protokoll – WLAN – 802.11 Protokoll – ANT, Thread, Zigbee – 802.15.4 Qualifikation Verpackung
Ezurio Multiprotokoll-Module Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, Cut Tape
243erwartet ab 02.09.2026
Min.: 1
Mult.: 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Multiprotokoll-Module Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, Cut Tape
250erwartet ab 21.09.2026
Min.: 1
Mult.: 1
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Multiprotokoll-Module 60 Series, Sterling Module w/u.FL, USB/UART
149erwartet ab 08.02.2027
Min.: 1
Mult.: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm UART, USB 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Kaga FEI Multiprotokoll-Module WLAN module for NXP IW611. WiFi 6 1x1 dual band, BT, BLE 5.4
300erwartet ab 17.11.2026
Min.: 1
Mult.: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
Kaga FEI Multiprotokoll-Module WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
300erwartet ab 17.11.2026
Min.: 1
Mult.: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray


Espressif Systems Multiprotokoll-Module Espressifs AWS IoT ExpressLink Module, pre-provisioned with required certificates and the ExpressLink firmware, for out-of-the-box connectivity to AWS IoT Core.
1.298Auf Bestellung
Min.: 1
Mult.: 1
2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 2.7 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 16.6 mm x 2.4 mm Bluetooth Bulk
u-blox Multiprotokoll-Module RW612, 802.11ax+BLE+802.15.4, ant pin, open CPU, 16MB
495erwartet ab 18.01.2027
Min.: 1
Mult.: 1
: 250

2.4 GHz, 5 GHz 11 dBm 3.15 V 3.45 V - 40 C + 85 C Antenna Pin Bluetooth LE/IEEE 802.15.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
u-blox Multiprotokoll-Module Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip
250erwartet ab 12.10.2026
Min.: 1
Mult.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Multiprotokoll-Module Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
750erwartet ab 31.12.2026
Min.: 1
Mult.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Multiprotokoll-Module M.2 Type 2230 Key E card with MAYA-W472 Wi-Fi 6 Dual-Band, Bluetooth 5.4, 802.15.4 module
140erwartet ab 01.02.2027
Min.: 1
Mult.: 1

MAYA-W4 2.405 GHz to 2.48 GHz 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Tray
u-blox Multiprotokoll-Module IW612, 802.11ax+BT+802.15.4, 1 PCB antenna or ant. pin
958Auf Bestellung
Min.: 1
Mult.: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape, MouseReel
u-blox Multiprotokoll-Module Host-based dual-band Wi-Fi 6 and Bluetooth LE module for IoT, 1 antenna pin
500erwartet ab 31.12.2026
Min.: 1
Mult.: 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 15 dBm, 18 dBm SPI, UART, USB 3.13 VDC 3.46 VDC - 40 C + 85 C Pin 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Multiprotokoll-Module Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, 2 ant pins
1.000erwartet ab 01.02.2027
Min.: 1
Mult.: 1
: 500

MAYA-W4 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Reel, Cut Tape
u-blox Multiprotokoll-Module Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, U.FL conn, NXP610
1.000erwartet ab 01.02.2027
Min.: 1
Mult.: 1
: 500

MAYA-W4 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Reel, Cut Tape
u-blox Multiprotokoll-Module Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, embedded antenna
1.000erwartet ab 01.02.2027
Min.: 1
Mult.: 1
: 500

MAYA-W4 2.402 GHz to 2.48 GHz 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Reel, Cut Tape
Silicon Labs Multiprotokoll-Module SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package?
200Auf Bestellung
Min.: 1
Mult.: 1

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
Wurth Elektronik Multiprotokoll-Module WIRL-NFW2 Orthosie-I w/o firmware-with RFplug w/ FL & RF shield 9.0x13.0x2.0mm
500erwartet ab 26.02.2027
Min.: 1
Mult.: 1
: 500

WIRL-NFW2 2.472 GHz, 2.48 GHz 21 dBm ADC, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 13 mm x 9.5 mm x 2 mm Bluetooth LE WiFi Reel, Cut Tape, MouseReel
Murata Electronics Multiprotokoll-Module Type 1SJ Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 6.2
999erwartet ab 24.02.2027
Min.: 1
Mult.: 1
: 1.000

1SJ 868 MHz, 915 MHz 21.5 dBm UART - 40 C + 85 C 10 mm x 8 mm x 1.6 mm LoRa/LoRaWAN Reel, Cut Tape
Telit Cinterion Multiprotokoll-Module
387erwartet ab 21.09.2026
Min.: 1
Mult.: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm NBIoT, LTE GPS, GLONASS Tray
Digi Multiprotokoll-Module Digi XBee 3 Global LTE-M/NB-IoT, GNSS, 2G fallback, Telit ME310G1-WW, AT&T SIM
25erwartet ab 31.08.2026
Min.: 1
Mult.: 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Embedded Artists Multiprotokoll-Module 2FY M.2 Module
49Auf Bestellung
Min.: 1
Mult.: 1

2.4 GHz to 2.484 GHz 9 dBm Audio, SDIO, UART 3.15 V 3.46 V - 40 C + 85 C U.FL Bluetooth 5.0 802.11a/b/g/n/ac/ax, 6/6E Bulk
NXP Semiconductors Multiprotokoll-Module IW611HN/A1C
25erwartet ab 29.10.2026
Min.: 1
Mult.: 1
: 2.000

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Reel, Cut Tape
Silicon Labs Multiprotokoll-Module 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules Vorlaufzeit 52 Wochen
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 1.85 V 3.3 V - 40 C + 85 C External 9.8 mm x 9.1 mm x 1.6 mm Bluetooth 5.0 802.11 a/b/g/n Tray
Silicon Labs Multiprotokoll-Module 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
786erwartet ab 02.09.2026
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 3 V 3.63 V - 40 C + 85 C External 9.1 mm x 9.8 mm x 1.6 mm Bluetooth 5.0 Tray
Murata Electronics Multiprotokoll-Module Type 2DL-921, Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module
2.675Auf Bestellung
Min.: 1
Mult.: 1
: 1.000

2DL 2.4 GHz, 5 GHz 18 dBm UART 1.71 V 3.46 V - 40 C + 85 C u.FL 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 Reel, Cut Tape, MouseReel