|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-04-1-K-TR
- Samtec
-
625:
5,96 €
-
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
Mouser-Teilenr.
200-LPAM10010L041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
|
Min.: 625
Mult.: 625
:
625
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-04-2-K-FR
- Samtec
-
625:
5,96 €
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM10010L042KFR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
Min.: 625
Mult.: 625
:
625
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-06-1-K-TR
- Samtec
-
400:
8,02 €
-
Nicht-auf-Lager-Vorlaufzeit 9 Wochen
|
Mouser-Teilenr.
200-LPAM10010L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 9 Wochen
|
|
Min.: 400
Mult.: 400
:
400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-06-2-K-TR
- Samtec
-
400:
7,01 €
-
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
|
Mouser-Teilenr.
200-LPAM10010L062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
|
|
Min.: 400
Mult.: 400
:
400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-08-1-K-TR
- Samtec
-
400:
8,90 €
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM10010L081KTR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 400
Mult.: 400
:
400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-08-2-K-FR
- Samtec
-
400:
9,03 €
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM10010L082KFR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
Min.: 400
Mult.: 400
:
400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-08-2-K-TR
- Samtec
-
1:
12,86 €
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM10010L082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 1
Mult.: 1
:
400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-04-2-K-TR
- Samtec
-
625:
6,37 €
-
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
Mouser-Teilenr.
200-LPAM10010S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
|
|
6,37 €
|
|
|
6,30 €
|
|
|
6,22 €
|
|
Min.: 625
Mult.: 625
:
625
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-06-1-K-TR
- Samtec
-
400:
8,76 €
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM10010S061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 400
Mult.: 400
:
400
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-06-2-K-TR
- Samtec
-
1:
11,83 €
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAM10010S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 1
Mult.: 1
:
400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-08-2-K-TR
- Samtec
-
400:
10,11 €
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM10010S082KTR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 400
Mult.: 400
:
400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-04-1-K-TR
- Samtec
-
575:
5,89 €
-
Nicht-auf-Lager-Vorlaufzeit 12 Wochen
|
Mouser-Teilenr.
200-LPAM10015L041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 12 Wochen
|
|
|
5,89 €
|
|
|
5,82 €
|
|
|
5,74 €
|
|
Min.: 575
Mult.: 575
:
575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-04-2-K-FR
- Samtec
-
575:
5,28 €
-
Nicht-auf-Lager-Vorlaufzeit 12 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM10015L042KFR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 12 Wochen
|
|
Min.: 575
Mult.: 575
:
575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-04-2-K-TR
- Samtec
-
575:
5,27 €
-
Nicht-auf-Lager-Vorlaufzeit 12 Wochen
|
Mouser-Teilenr.
200-LPAM10015L042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 12 Wochen
|
|
Min.: 575
Mult.: 575
:
575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-06-1-K-TR
- Samtec
-
1:
10,87 €
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM10015L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 1
Mult.: 1
:
375
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-06-2-K-TR
- Samtec
-
375:
7,86 €
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM10015L062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 375
Mult.: 375
:
375
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-08-1-K-FR
- Samtec
-
375:
9,23 €
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM10015L081KFR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 375
Mult.: 375
:
375
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-08-1-K-TR
- Samtec
-
375:
11,65 €
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM10015L081KTR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 375
Mult.: 375
:
375
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-08-2-K-TR
- Samtec
-
1:
13,13 €
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAM10015L082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 1
Mult.: 1
:
375
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-S-04-1-K-TR
- Samtec
-
1:
10,14 €
-
Nicht-auf-Lager-Vorlaufzeit 12 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM10015S041KTR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 12 Wochen
|
|
|
10,14 €
|
|
|
9,46 €
|
|
|
8,94 €
|
|
|
8,19 €
|
|
|
6,60 €
|
|
|
Anzeigen
|
|
|
7,03 €
|
|
|
6,42 €
|
|
|
6,34 €
|
|
Min.: 1
Mult.: 1
:
575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-S-04-2-K-TR
- Samtec
-
575:
6,82 €
-
Nicht-auf-Lager-Vorlaufzeit 12 Wochen
|
Mouser-Teilenr.
200-LPAM10015S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 12 Wochen
|
|
Min.: 575
Mult.: 575
:
575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-S-06-1-K-FR
- Samtec
-
375:
8,91 €
-
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM10015S061KFR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
|
Min.: 375
Mult.: 375
:
375
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-S-06-1-K-TR
- Samtec
-
375:
10,41 €
-
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM10015S061KTR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
|
Min.: 375
Mult.: 375
:
375
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-S-06-2-K-TR
- Samtec
-
1:
12,07 €
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM10015S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 1
Mult.: 1
:
375
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-S-08-2-K-TR
- Samtec
-
375:
10,29 €
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM10015S082KTR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 375
Mult.: 375
:
375
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|