HF300P-0.0015-00-122

Bergquist Company
951-HF300P0001500122
HF300P-0.0015-00-122

Herst.:

Beschreibung:
Thermische Schnittstellenprodukte Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF1600P/300P

ECAD Model:
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Verfügbarkeit

Lagerbestand:
Nicht auf Lager
Lieferzeit ab Hersteller:
Minimum: 1793   Vielfache: 1
Stückpreis:
-,-- €
Erw. Preis:
-,-- €
Vorauss. Zolltarif:
Dieses Produkt wird KOSTENLOS versandt

Preis (EUR)

Menge Stückpreis
Erw. Preis
0,372 € 667,00 €
0,342 € 855,00 €

Produktattribut Attributwert Attribut auswählen
Bergquist Company
Produktkategorie: Thermische Schnittstellenprodukte
RoHS:  
Phase Change Materials
Non-standard
Silicone Elastomer
5 kVAC
Green
+ 150 C
0.127 mm
48 MPa
UL 94 V-0
300P / THF 1600P
Marke: Bergquist Company
Bestimmt für: Electronic Components and Heat Sink
Produkt-Typ: Thermal Interface Products
Verpackung ab Werk: 1
Unterkategorie: Thermal Management
Handelsname: Hi-Flow
Artikel # Aliases: BG421422 HF300P1.5-122 2190519
Gewicht pro Stück: 283 mg
Produkte gefunden:
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Ausgewählte Attribute: 0

USHTS:
3921904090
ECCN:
EAR99

GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.

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