Telink Multiprotokoll-Module

Ergebnisse: 3
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Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Serie
Frequenz
Ausgangsleistung
Schnittstellen-Typ
Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Abmessungen
Protokoll – ANT, Thread, Zigbee – 802.15.4
Verpackung
Telink Multiprotokoll-Module Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datenblatt
6Auf Lager
Min.: 1
Mult.: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Telink Multiprotokoll-Module Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datenblatt
6Auf Lager
Min.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Telink Multiprotokoll-Module Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
Min.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel