ARM Cortex M33 Kern Drahtlose & HF-Module

Arten von drahtlosen & HF-Modulen

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Ergebnisse: 66
Auswählen Bild Teile-Nr. Herst. Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern. Menge RoHS Produkt-Typ Produkt Frequenz Schnittstellen-Typ Protokoll – Bluetooth, BLE – 802.15.1 Protokoll – Mobilfunk, NBIoT, LTE Protokoll – GPS, GLONASS Protokoll – WLAN – 802.11 Protokoll – ANT, Thread, Zigbee – 802.15.4
Silicon Labs Bluetooth-Module – 802.15.1 Wireless bluetooth SiP module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8 MHz, 6 dBm, AoA Receive or BLE Long Range PHY Rates(125kbps and 500kbps), LFXO, 512kB, 32kB(RAM), Built-in antenna/RF Pin, 24 GPIO, 105C
4.660erwartet ab 02.06.2026
Min.: 1
Mult.: 1

Bluetooth Modules Bluetooth Modules 2.44 GHz I2C, SPI, UART Bluetooth LE
Silicon Labs Bluetooth-Module – 802.15.1 Wireless bluetooth SiP module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8 MHz, 6 dBm, AoA Receive or BLE Long Range PHY Rates(125kbps and 500kbps), LFXO, 512kB, 32kB(RAM), Built-in antenna/RF Pin, 24 GPIO, 105C
9.327Auf Bestellung
Min.: 1
Mult.: 1
: 2.500

Bluetooth Modules Bluetooth Modules 2.44 GHz I2C, SPI, UART Bluetooth LE
Nordic Semiconductor Multiprotokoll-Module Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
2.488erwartet ab 25.12.2026
Min.: 1
Mult.: 1
: 2.500

Multiprotocol Modules DECT NR+, GPS, LTE CatM1/NB1/NB2, QZSS 700 MHz to 2.2 GHz I2C, I2S, SPI, UART DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS
Quectel Bluetooth-Module – 802.15.1 BLE 5.4 standalone module, 32 KB RAM, 352 KB flash, transmit power = 6 dBm, -40 C to +85 C, PCB antenna
500erwartet ab 27.05.2026
Min.: 1
Mult.: 1
: 500
Bluetooth Modules 2.4 GHz UART Bluetooth LE
Silicon Labs Bluetooth-Module – 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 1.000
Mult.: 1.000
: 1.000

Bluetooth Modules 2.44 GHz I2C Bluetooth LE
Silicon Labs Multiprotokoll-Module MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 1
Mult.: 1

Multiprotocol Modules Bluetooth Modules 2.4 GHz I2C, USART Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee)
Silicon Labs Multiprotokoll-Module MGM220P wireless gecko Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 1.000
Mult.: 1.000
: 1.000

Multiprotocol Modules Bluetooth 5.4, Bluetooth Mesh, Zigbee 2.4 GHz Bluetooth, GPIO, I2C, UART Bluetooth 5.2, Bluetooth Mesh Zigbee
Infineon Technologies Bluetooth-Module – 802.15.1 BLE INDUSTRIAL AND IOT Nicht-auf-Lager-Vorlaufzeit 29 Wochen
Min.: 1
Mult.: 1
: 500

Bluetooth Modules Bluetooth Modules 2.4 GHz GPIO, I2C, I2S, SPI, UART Bluetooth LE
Fanstel Multiprotokoll-Module nRF5340 BLE 5.4 and nRF7002 WiFi 6 combo modules, 2 chip antennas Nicht-auf-Lager-Vorlaufzeit 10 Wochen

Multiprotocol Modules 802.11 a/b/g/n/ac/ax, 802.15.4, BLE 2.4 GHz, 5 GHz GPIO, I2C, QSPI, SPI, SWD, UART, USB 2.0 BLE 802.11 a/b/g/n/ac/ax 802.15.4
Quectel Bluetooth-Module – 802.15.1 Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 1
Mult.: 1

Bluetooth Modules 2.4 GHz ADC, GPIO< I2C, I2S, JTAG, PWM, SPI, SWD, UART Bluetooth LE
Quectel Bluetooth-Module – 802.15.1 Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 1
Mult.: 1
Bluetooth Modules 2.4 GHz UART Bluetooth LE
Quectel Bluetooth-Module – 802.15.1 BLE 5.4 standalone module w/ chip antenna in LGA FF, 32 KB RAM, 512 KB flash, 18 GPIOs, transmit power 8 dBm, -40 C to +85 C Nicht-auf-Lager-Vorlaufzeit 12 Wochen
Min.: 1.000
Mult.: 1
Bluetooth Modules Bluetooth Modules I2C, SPI, USART Bluetooth LE
Quectel Bluetooth-Module – 802.15.1 BT 5.4 & BLE Mesh, 20 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, PCB antenna Nicht-auf-Lager-Vorlaufzeit 15 Wochen
Min.: 1.000
Mult.: 1.000
: 1.000

Bluetooth Modules 2.4 GHz ADC, GPIO< I2C, I2S, JTAG, PWM, SPI, SWD, UART Bluetooth LE
Quectel Bluetooth-Module – 802.15.1 BT 5.4 & BLE Mesh, 10 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, PCB antenna Nicht-auf-Lager-Vorlaufzeit 15 Wochen
Min.: 1.000
Mult.: 1.000
: 1.000

Bluetooth Modules 2.4 GHz ADC, GPIO< I2C, I2S, JTAG, PWM, SPI, SWD, UART Bluetooth LE
Quectel Bluetooth-Module – 802.15.1 BT 5.4 & BLE Mesh, 10 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 to +105 , PCB antenna Nicht-auf-Lager-Vorlaufzeit 15 Wochen
Min.: 1.000
Mult.: 1
Bluetooth Modules Bluetooth Modules I2C, USART Bluetooth LE
Quectel Bluetooth-Module – 802.15.1 BT 5.4 & BLE Mesh, 10 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 to +105 , RF antenna connector Nicht-auf-Lager-Vorlaufzeit 15 Wochen
Min.: 1.000
Mult.: 1
Bluetooth Modules Bluetooth Modules I2C, USART Bluetooth LE