Renesas / Dialog Drahtlose & HF-Module

Arten von drahtlosen & HF-Modulen

Kategorieansicht ändern
Ergebnisse: 18
Auswählen Bild Teile-Nr. Herst. Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern. Menge RoHS Produkt-Typ Produkt Frequenz Schnittstellen-Typ Protokoll – Bluetooth, BLE – 802.15.1 Protokoll – WLAN – 802.11
Renesas / Dialog Bluetooth-Module – 802.15.1 Bluetooth Low Energy DA14592 module daughterboard for the DA14695MOD-DEVKT-P Pro motherboard
24Auf Lager
Min.: 1
Mult.: 1

Bluetooth Modules Bluetooth
Renesas / Dialog Multiprotokoll-Module Wi-Fi/BLE Combo Module (Chipset antenna) 839Auf Lager
Min.: 1
Mult.: 1
Rolle: 500

Multiprotocol Modules WiFi Modules 2.4 GHz I2C, I2S, PWM, SPI, SWD, JTAG, UART Bluetooth 5.1 802.11 b/g/n
Renesas / Dialog Multiprotokoll-Module Wi-Fi/BLE Combo Module (u.FL connector) 241Auf Lager
Min.: 1
Mult.: 1
Rolle: 500

Multiprotocol Modules WiFi, BLE Modules 2.4 GHz I2C, UART Bluetooth 5.1 802.11 b/g/n
Renesas / Dialog WLAN-Module – 802.11 Wi-Fi SoC Module (u.FL connector) 628Auf Lager
Min.: 1
Mult.: 1
Rolle: 500

WiFi Modules 2.4 GHz GPIO, I2C, I2S, JTAG, PWM, SDIO, SPI, SWD, UART 802.11 b/g/n
Renesas / Dialog Bluetooth-Module – 802.15.1 Bluetooth Low Energy 5.1 Module with integrated ARM Cortex M0+, memories and peripherals ? 8 GPIOs 202Auf Lager
Min.: 1
Mult.: 1
Rolle: 300

Bluetooth Modules 2.48 GHz ADC, GPIO, I2C, SPI, UART Bluetooth
Renesas / Dialog Bluetooth-Module – 802.15.1 Bluetooth Low Energy 5.2 Module with integrated ARM Cortex M33, memories and peripherals 1.162Auf Lager
Min.: 1
Mult.: 1
Rolle: 700

Bluetooth Modules
Renesas / Dialog Bluetooth-Module – 802.15.1 Multi-core wireless Module for Bluetooth 5.2 and prop 2G4 protocolswith integrated ARM Cortex M33, memories and peripherals 582Auf Lager
Min.: 1
Mult.: 1
Rolle: 700

Bluetooth Modules Bluetooth Modules 2.4 GHz I2C, SPI, UART Bluetooth
Renesas / Dialog Bluetooth-Module – 802.15.1 Multi-core wireless Module for Bluetooth 5.2 and prop 2G4 protocolswith integrated ARM Cortex M33, memories and peripherals 397Auf Lager
Min.: 1
Mult.: 1
Rolle: 100

Bluetooth Modules 2.4 GHz
Renesas / Dialog Bluetooth-Module – 802.15.1 Multi-Core BLE 5.2 SoC with Embedded FLASH 1.432Auf Lager
Min.: 1
Mult.: 1
Rolle: 5.500

Bluetooth Modules
Renesas / Dialog Bluetooth-Module – 802.15.1 Multi-Core BLE 5.2 SoC with Embedded FLASH 2.845Auf Lager
Min.: 1
Mult.: 1
Rolle: 8.000

Bluetooth Modules
Renesas / Dialog Bluetooth-Module – 802.15.1 Bluetooth Low Energy DA14592 WLCSP daughterboard for the DA14592DEVKT-P Pro motherboard
48Auf Lager
Min.: 1
Mult.: 1

Bluetooth Modules
Renesas / Dialog Bluetooth-Module – 802.15.1 Bluetooth Low Energy 5.1 Module with integrated ARM Cortex M0+, memories and peripherals ? 8 GPIOs 9.529Auf Lager
Min.: 1
Mult.: 1
Rolle: 1.000

Bluetooth Modules 2.44 GHz I2C, SPI, UART Bluetooth
Renesas / Dialog Bluetooth-Module – 802.15.1 Bluetooth Low Energy DA14592 FCQFN daughterboard for the DA14592DEVKT-P Pro motherboard 25Auf Lager
Min.: 1
Mult.: 1

Bluetooth Modules
Renesas / Dialog WLAN-Module – 802.11 Wi-Fi SoC Module (Chipset Antenna) 1.002Auf Lager
Min.: 1
Mult.: 1
Rolle: 500

WiFi Modules 2.4 GHz GPIO, I2C, I2S, JTAG, PWM, SDIO, SPI, SWD, UART
Renesas / Dialog Bluetooth-Module – 802.15.1 Bluetooth Low Energy 5.3 Module with integrated ARM Cortex M0+, memories and peripherals
1.000erwartet ab 20.02.2026
Min.: 1
Mult.: 1
Rolle: 1.000

Bluetooth Modules Bluetooth Modules 1-Wire, I2C, SPI, UART Bluetooth
Renesas / Dialog Bluetooth-Module – 802.15.1 Bluetooth Low Energy 5.2 Module with integrated ARM Cortex M33, memories and peripherals Nicht-auf-Lager-Vorlaufzeit 18 Wochen
Min.: 100
Mult.: 100
Rolle: 100

Bluetooth Modules
Renesas / Dialog Bluetooth-Module – 802.15.1 Bluetooth Low Energy 5.3 Module with integrated ARM Cortex M0+, memories and peripherals Nicht-auf-Lager-Vorlaufzeit 18 Wochen
Min.: 300
Mult.: 300
Rolle: 300

Bluetooth Modules Bluetooth Modules 1-Wire, I2C, SPI, UART Bluetooth
Renesas / Dialog DA14581-00000VRA
Renesas / Dialog Bluetooth-Module – 802.15.1 Bluetooth Low Energy 4.2 SoC optimized for A4WP and HCI applications ? 12 GPIOsin ultra-thin WL-CSP34 and 0.4mm ball pitch package Nicht-auf-Lager-Vorlaufzeit 18 Wochen
Min.: 5.000
Mult.: 5.000
Rolle: 5.000

Bluetooth Modules Bluetooth LE