congatec conga-TS170 Serie Computer-On-Module - COM

Ergebnisse: 6
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Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Formfaktor
Prozessormarke
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Chipsets
Frequenz
Maximale RAM-Kapazität
Installiertes RAM
Cache-Speicher
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Abmessungen
congatec conga-TS170/i3-6102E CM236
congatec Computer-On-Module - COM COM Express Type 6 Basic module with Skylake-H Intel Core i3-6102E quad core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface.
Datenblatt
2Auf Lager
Min.: 1
Mult.: 1
0 GB 0 GB 3 MB
congatec conga-TS170/i3-6100E CM236
congatec Computer-On-Module - COM COM Express Type 6 Basic module with Skylake-H Intel Core i3-6100E quad core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface.
Datenblatt
1Auf Lager
Min.: 1
Mult.: 1
0 GB 0 GB 3 MB
congatec Computer-On-Module - COM COM Express Type 6 Basic module with Skylake-H Intel Celeron G3900E dual core processor with 2.4GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset HM170
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1

COM Express Type 6 Intel Celeron G3900E HM170 2.4 GHz 32 GB 2 MB 2 MB 0 C + 60 C 95 mm x 125 mm
congatec Computer-On-Module - COM COM Express Type 6 Basic module with Skylake-H Intel Celeron G3902E dual core processor with 1.6GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset HM170
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 1
Mult.: 1

COM Express Type 6 Intel Celeron G3902E HM170 1.6 GHz 32 GB 2 MB 2 MB 0 C + 60 C 95 mm x 125 mm
congatec Computer-On-Module - COM Standard heatpipe based passive cooling solution for high performance COM Express Type 6 module conga-TS170, conga-TS175 and conga-TS370 with 15mm high fins and 20mm overall heat sink height. Stand-offs are with 2.7mm bore hole.
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM Standard heatpipe based passive cooling solution for high performance COM Express Type 6 module conga-TS170, conga-TS175 and conga-TS370 with 15mm high fins and 20mm overall heat sink height. All stand-offs are M2.5 threaded.
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1