ARM Cortex-M33 Kern Drahtlose & HF-Module

Arten von drahtlosen & HF-Modulen
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Ergebnisse: 51
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Menge RoHS Produkt-Typ
Produkt
Frequenz
Schnittstellen-Typ
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – WLAN – 802.11
Protokoll – ANT, Thread, Zigbee – 802.15.4
Protokoll – Sub-GHz
Fanstel Bluetooth-Module – 802.15.1 Mini nRF54L15 BLE 6.0 module, 1.5MB flash, 256KB RAM, PCB antenna
Datenblatt
2.000Auf Bestellung
Min.: 1
Mult.: 1
: 1.000

Bluetooth Modules Bluetooth Modules I2C, SPI, UART, USB Bluetooth LE WiFi 802.15.4 (ANT, Thread, Zigbee) NFC
Ezurio Multiprotokoll-Module Module, BL54L15, Bluetooth LE, Chip Antenna, Cut Tape
Datenblatt
1.229erwartet ab 01.06.2026
Min.: 1
Mult.: 1

Multiprotocol Modules Multiprotocol Modules I2S, SPI, UART Bluetooth LE 802.15.4
Ezurio Multiprotokoll-Module Module, BL54L15, Bluetooth LE, Chip Antenna, Tape and Reel
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1
Mult.: 1
: 1.000
Multiprotocol Modules Multiprotocol Modules I2S, SPI, UART Bluetooth LE 802.15.4
Ezurio Multiprotokoll-Module Module, BL54L15, Bluetooth LE, Trace Pin, Tape and Reel
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1
Mult.: 1
: 1.000
Multiprotocol Modules Multiprotocol Modules I2S, SPI, UART Bluetooth LE 802.15.4
Ezurio Multiprotokoll-Module Module, BL54L10, Bluetooth LE, Trace ANT, Tape and Reel
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1
Mult.: 1
: 1.000
Multiprotocol Modules Multiprotocol Modules 2.402 GHz to 2.48 GHz I2S, SPI, UART Bluetooth LE 802.15.4
Ezurio Multiprotokoll-Module Module, BL54L10, Bluetooth LE, MHF4, Tape and Reel
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1.000
Mult.: 1.000
: 1.000
Multiprotocol Modules Multiprotocol Modules 2.402 GHz to 2.48 GHz I2S, SPI, UART Bluetooth LE 802.15.4
u-blox Bluetooth-Module – 802.15.1 Bluetooth Low Energy stand-alone module,antenna pin for external antenna, Open CPU with CAN FD
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
Min.: 500
Mult.: 500
: 500

Bluetooth Modules Bluetooth Modules 2.402 GHz to 2.48 GHz I2C, SPI, UART Bluetooth 802.15.4 (ANT, Thread, Zigbee)
u-blox Bluetooth-Module – 802.15.1 Bluetooth Low Energy stand-alone module,embedded PCB trace antenna, Open CPU
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
Min.: 1
Mult.: 1
: 500

Bluetooth Modules Bluetooth Modules 2.402 GHz to 2.48 GHz I2C, SPI, UART Bluetooth 802.15.4 (ANT, Thread, Zigbee)
Silicon Labs Multiprotokoll-Module Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, PCB trace antenna, certified.
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 100
Mult.: 100

Multiprotocol Modules Multiprotocol Lighting Modules 2.4 GHz I2C, UART Bluetooth Thread, Zigbee
Silicon Labs Multiprotokoll-Module Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, PCB trace antenna, certified.
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 1.000
Mult.: 1.000
: 1.000

Multiprotocol Modules 2.4 GHz I2C, UART Thread, Zigbee
Silicon Labs Multiprotokoll-Module Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 1
Mult.: 1

Multiprotocol Modules Multiprotocol Lighting Modules 2.4 GHz I2C, UART Bluetooth Thread, Zigbee
Silicon Labs Multiprotokoll-Module Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 1.000
Mult.: 1.000
: 1.000

Multiprotocol Modules 2.4 GHz I2C, UART Thread, Zigbee
Silicon Labs Multiprotokoll-Module 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 2.500
Mult.: 2.500
: 2.500

Multiprotocol Modules Multiprotocol Module 76.8 MHz Bluetooth
Fanstel BM05M
Fanstel Bluetooth-Module – 802.15.1 Mini nRF54L05 BLE 6.0 module, 500KB flash, 96 KB RAM, PCB antenna
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
Min.: 1
Mult.: 1
: 1.000

Bluetooth Modules Bluetooth Modules I2C, SPI
Silex Technology Multiprotokoll-Module Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 34 Wochen
Min.: 500
Mult.: 500
: 500

Multiprotocol Modules Multiprotocol Modules 260 MHz I2C, SPI, UART 802.11 a/b/g/n/ac/ax
Silex Technology Multiprotokoll-Module IM-100 is a small, stand-alone, dual-band Wi-Fi 6 and Bluetooth Low Energy
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 34 Wochen
Min.: 1
Mult.: 1

Multiprotocol Modules Multiprotocol Modules 260 MHz I2C, SPI, UART 802.11 a/b/g/n/ac/ax
Silex Technology Multiprotokoll-Module the option to attach an antenna via a trace. does not include the u.Fl connector
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 34 Wochen
Min.: 500
Mult.: 500
: 500

Multiprotocol Modules Multiprotocol Modules 260 MHz I2C, SPI, UART 802.11 a/b/g/n/ac/ax
Silex Technology Multiprotokoll-Module the option to attach an antenna via a trace does not include the u.Fl connector
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 34 Wochen
Min.: 1
Mult.: 1

Multiprotocol Modules Multiprotocol Modules 260 MHz I2C, SPI, UART 802.11 a/b/g/n/ac/ax
Quectel Bluetooth-Module – 802.15.1 Dual-antenna Bluetooth 6.0 module, support channel sounding with high robustness and accuracy, optimized for proximity awareness, localization and digital key
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 26 Wochen
Min.: 2.000
Mult.: 1
Bluetooth Modules Bluetooth Modules 78 MHz I2C, SPI, UART Bluetooth
Quectel KCMA32SAAMD-0P
Quectel Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: PCB
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 500
Mult.: 1
Multiprotocol Modules Multi Protocol Modules 80 MHz I2C, I2S, SPI, UART BLE 5.3 Zigbee 3.0
Quectel KCMA32SAAMD-1X
Quectel Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 500
Mult.: 1
Multiprotocol Modules Multi Protocol Modules 80 MHz I2C, I2S, SPI, UART BLE 5.3 Zigbee 3.0
Quectel KCMA32SABMD-0P
Quectel Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 500
Mult.: 1
Multiprotocol Modules Multi Protocol Modules 80 MHz I2C, I2S, SPI, UART BLE 5.3 Zigbee 3.0
Quectel KCMA32SABMD-1X
Quectel Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 500
Mult.: 1
Multiprotocol Modules Multi Protocol Modules 80 MHz I2C, I2S, SPI, UART BLE 5.3 Zigbee 3.0
Quectel FCM363XABMD-0P-08
Quectel Multiprotokoll-Module Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40-85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 26 Wochen
Min.: 250
Mult.: 1
Multiprotocol Modules Modules 2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB
Quectel FCM363XABMD-4X-08
Quectel Multiprotokoll-Module Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: 4th gen RF coax, -40-85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 26 Wochen
Min.: 250
Mult.: 1
Multiprotocol Modules Modules 2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 802.11a/b/g/n/ac/ax