5G Automotive- und Transportlösungen

Die 5G-Konnektivität für Automotive- und Transportlösungen von Samtec erfüllt die Anforderungen des wachsenden 5G-Netzwerkmarktes. Da die Implementierung des 5G-Netzwerks schnell an Dynamik gewinnt, werden neue Hochleistungsbauteile, Systeme sowie Prüf- und Messgeräte benötigt, um die extrem hohen Frequenzen und hohen Datenraten zu unterstützen, die Technologien wie mmWave, Massive MIMO, Strahlformung und Vollduplex-Anforderungen erfordern. Samtec bietet Hochleistungsverbindungen zusammen mit hohem technischem Know-how zur Unterstützung dieser Anforderungen, einschließlich eines wachsenden Portfolios von Lösungen, die sich hervorragend für Fahrzeuganwendungen eignen.

Ergebnisse: 4.277
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Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Produkt
Anzahl der Positionen
Abstand
Anzahl der Zeilen
Montage
Montagewinkel
Stackhöhe
Nennstrom
Nennspannung
Maximale Datenrate
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Kontaktüberzug
Kontaktmaterial
Gehäusematerial
Serie
Verpackung
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
261Auf Lager
Min.: 1
Mult.: 1
Rolle: 150

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 11 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
55Auf Lager
Min.: 1
Mult.: 1

Headers 240 Position 0.5 mm (0.02 in) 2 Row Solder Straight 25 mm 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
186Auf Lager
Min.: 1
Mult.: 1

Headers 50 Position 0.635 mm (0.025 in) 2 Row Solder Straight 1.8 A 285 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTS Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
348Auf Lager
Min.: 1
Mult.: 1
Rolle: 425

Headers 100 Position 0.635 mm (0.025 in) 2 Row Solder Straight 1.8 A 285 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTS Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
150Auf Lager
Min.: 1
Mult.: 1
Rolle: 150

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
279Auf Lager
Min.: 1
Mult.: 1
Rolle: 225

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
165Auf Lager
Min.: 1
Mult.: 1
Rolle: 225

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
343Auf Lager
Min.: 1
Mult.: 1
Rolle: 325

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
225Auf Lager
Min.: 1
Mult.: 1
Rolle: 200

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
200Auf Lager
Min.: 1
Mult.: 1
Rolle: 200
Nein
Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
639Auf Lager
Min.: 1
Mult.: 1
Rolle: 375
Sockets 120 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
149Auf Lager
Min.: 1
Mult.: 1
Rolle: 300
Nein
Sockets 200 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
193Auf Lager
Min.: 1
Mult.: 1
Rolle: 375
Nein
Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
328Auf Lager
Min.: 1
Mult.: 1
Rolle: 475
Nein
Connectors 40 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
272Auf Lager
Min.: 1
Mult.: 1
Rolle: 225
Nein
Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
136Auf Lager
Min.: 1
Mult.: 1
Rolle: 150
Nein
Headers 560 Position 1.27 mm (0.05 in) 14 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
88Auf Lager
Min.: 1
Mult.: 1
Rolle: 200
Nein
Sockets 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
200Auf Lager
Min.: 1
Mult.: 1
Rolle: 250
Nein
Sockets 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
106Auf Lager
MouseReel verfügbar
Min.: 1
Mult.: 1
Rolle: 225
Nein
Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape, MouseReel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
185Auf Lager
Min.: 1
Mult.: 1
Rolle: 225
Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
277Auf Lager
Min.: 1
Mult.: 1
Rolle: 225
Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
87Auf Lager
Min.: 1
Mult.: 1
Rolle: 275
Nein
Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
271Auf Lager
Min.: 1
Mult.: 1
Rolle: 250
Sockets 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
370Auf Lager
Min.: 1
Mult.: 1
Rolle: 200
Nein
Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm Q Strip High-Speed Ground Plane Socket Strip
Datenblatt
219Auf Lager
Min.: 1
Mult.: 1

Sockets 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 5 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSE Tray