TS391 No-Clean Solder Paste

Chip Quik TS391 No-Clean Solder Paste is a dispense grade, synthetic paste with no refrigeration required to maintain shelf life. The no-clean solder paste provides excellent wetting compatibility on most board finishes, exhibiting a wide process window with low voiding and long stencil life. Chip Quik TS391 solder paste leaves a clear residue and supports printing speeds up to 125mm/sec. This solder paste is available with three different alloy compositions, each with different melting points, in 15g, 35g, 50g, 250g, and 500g packaging. The RoHS II and REACH compliant paste features a T4 mesh size, 20µm to 38µm range, and a ROL0 flux classification.

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Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS Produkt
Typ
Beimischung
Baugruppenart
Chip Quik Lötmittel Paste No-Clean 15g Sn63/Pb37 T4
Datenblatt
559Auf Lager
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Lötmittel Paste No-Clean 35g Sn63/Pb37 T4
Datenblatt
154Auf Lager
324Auf Bestellung
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Lötmittel Paste No-Clean 50g Sn63/Pb37 T4
Datenblatt
365Auf Lager
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Lötmittel Paste NoClean 15g Sn42/Bi57.6/Ag0.4 T4
Datenblatt
153Auf Lager
294erwartet ab 13.07.2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Lötmittel Paste NoClean 35g Sn42/Bi57.6/Ag0.4 T4
Datenblatt
71Auf Lager
123erwartet ab 10.07.2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Lötmittel Paste NoClean 250g Sn42/Bi57.6/Ag0.4 T4
Datenblatt
33Auf Lager
54erwartet ab 15.07.2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Lötmittel Paste No-Clean 50g Sn42/Bi57.6/Ag0.4 T4
Datenblatt
134Auf Lager
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Lötmittel Paste NoClean 15g T4 Sn96.5/Ag3.0/Cu0.5
Datenblatt
173Auf Lager
40erwartet ab 22.06.2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Lötmittel Paste NoClean 35g T4 Sn96.5/Ag3.0/Cu0.5
Datenblatt
92Auf Lager
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Lötmittel Paste NoCln 250g T4 Sn96.5/Ag3.0/Cu0.5
Datenblatt
152Auf Lager
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Lötmittel Paste NoClean 50g T4 Sn96.5/Ag3.0/Cu0.5
Datenblatt
255Auf Lager
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Lötmittel Paste No-Clean 250g Sn63/Pb37 T4
Datenblatt
186Auf Bestellung
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Lötmittel Paste No-Clean 500g Sn63/Pb37 T4
Datenblatt
9Auf Bestellung
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Cartridge
Chip Quik Lötmittel Paste No-Clean 500g Sn42/Bi57.6/Ag0.4 T4
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Cartridge
Chip Quik Lötmittel Paste NoCln 500g T4 Sn96.5/Ag3.0/Cu0.5
Datenblatt
N/A
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Cartridge