Arrays mit hoher Dichte

Samtec Arrays mit hoher Dichte umfassen Board-to-Board-Mezzanine-Steckverbinder und rechteckige Kabelsätze. Diese Komponenten werden in einer großen Auswahl von Montagewinkeln angeboten, einschließlich horizontal, rechts, gerade und vertikal mit einer großen Auswahl von Anschlussarten. Die Anzahl der Positionen reicht von 100 bis 560, während die Anzahl der Reihen von 4 bis 14 reicht. Die Arrays mit hoher Dichte von Samtec sind in mehreren Rastermaßen, einschließlich 0,635 mm, 0,8 mm und 1,27 mm verfügbar.

Ergebnisse: 2.051
Auswählen Bild Teile-Nr.
 Herst.
Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Produkt
Anzahl der Positionen
Abstand
Anzahl der Zeilen
Montage
Montagewinkel
Stackhöhe
Nennstrom
Nennspannung
Maximale Datenrate
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Kontaktüberzug
Kontaktmaterial
Gehäusematerial
Serie
Verpackung
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
519Auf Lager
Min.: 1
Mult.: 1
Rolle: 325

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
620Auf Lager
Min.: 1
Mult.: 1
Rolle: 200

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
184Auf Lager
Min.: 1
Mult.: 1
Rolle: 375

Sockets 200 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
312Auf Lager
Min.: 1
Mult.: 1
Rolle: 400

Headers 40 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
461Auf Lager
Min.: 1
Mult.: 1
Rolle: 225

Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
155Auf Lager
Min.: 1
Mult.: 1
Rolle: 125

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 14 mm, 15 mm, 15.5 mm, 16.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
360Auf Lager
Min.: 1
Mult.: 1
Rolle: 375

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
97Auf Lager
Min.: 1
Mult.: 1
Rolle: 75

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 14 mm, 15 mm, 15.5 mm, 16.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
582Auf Lager
Min.: 1
Mult.: 1
Rolle: 350

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
178Auf Lager
Min.: 1
Mult.: 1
Rolle: 325

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
327Auf Lager
Min.: 1
Mult.: 1
Rolle: 375

Sockets 200 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
150Auf Lager
Min.: 1
Mult.: 1
Rolle: 150

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
279Auf Lager
Min.: 1
Mult.: 1
Rolle: 225

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
165Auf Lager
Min.: 1
Mult.: 1
Rolle: 225

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
343Auf Lager
Min.: 1
Mult.: 1
Rolle: 325

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
41Auf Lager
Min.: 1
Mult.: 1
Rolle: 50

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
225Auf Lager
Min.: 1
Mult.: 1
Rolle: 200

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
202Auf Lager
Min.: 1
Mult.: 1
Rolle: 175

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
66Auf Lager
Min.: 1
Mult.: 1
Rolle: 75

Sockets 400 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
196Auf Lager
Min.: 1
Mult.: 1
Rolle: 325

Sockets 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
101Auf Lager
Min.: 1
Mult.: 1
Rolle: 100

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
96Auf Lager
Min.: 1
Mult.: 1
Rolle: 125

Connectors 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
387Auf Lager
Min.: 1
Mult.: 1
Rolle: 550

Sockets 120 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 2.2 A 250 VAC Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
436Auf Lager
Min.: 1
Mult.: 1
Rolle: 375

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
107Auf Lager
Min.: 1
Mult.: 1
Rolle: 225

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape