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HDF-R62-113L012

Name: NorComp HDF-R62-113L012
Brand: NorComp
SKU: 636-HDF-R62-113L012
Price: 33.15 EUR
Availability: OutOfStock

Bilder dienen lediglich der Veranschaulichung und sind nicht Originalgetreu
Siehe Produktspezifikationen

Mouser-Nr.:

636-HDF-R62-113L012

Herst.- Nr.:

HDF-R62-113L012

Herst.:

NorComp

Beschreibung:

D-Sub-Steckverbinder mit hoher Dichte 62 pin R/A solder M 30u 4-40 int thrd

Datenblatt:

HDF-R62-113L012 Datenblatt (PDF)

ECAD Model:

Den kostenlosen Library Loader herunterladen, um diese Datei für Ihr ECAD Tool zu konvertieren. Weitere Infos zu ECAD-Modell.

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Weitere Informationen zu NorComp HDF-R62-113L012

Verfügbarkeit

Lagerbestand:: Nicht auf Lager

Ein unerwarteter Fehler ist aufgetreten. Bitte versuchen Sie es später noch einmal.
Lieferzeit ab Hersteller:: Voraussichtlichen Liefertermin anfordern

Menge eingeben:

Minimum: 27 Vielfache: 27

Stückpreis:

-,-- €

Erw. Preis:

-,-- €

Vorauss. Zolltarif:

Dieses Produkt wird KOSTENLOS versandt

Preis (EUR)

Menge	Stückpreis	Erw. Preis
	33,15 €	895,05 €
	33,03 €	1.783,62 €
	32,49 €	3.508,92 €
	32,40 €	8.748,00 €
513	Kostenvoranschlag

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Produktattribut	Attributwert	Attribut auswählen
Hersteller:	NorComp
Produktkategorie:	D-Sub-Steckverbinder mit hoher Dichte
RoHS:
Anzahl der Positionen:	62 Position
Anzahl der Zeilen:	3 Row
Anschlussart:	Male
Montage:	Solder Tail
Montagewinkel:	Right Angle
Kontaktüberzug:	Gold
Nennstrom:	3 A
Serie:	HDF
IP-Schutzklassen:	IP67
Verpackung:	Tray
Marke:	NorComp
Kontaktmaterial:	Brass
Gefiltert:	Unfiltered
Isolierung:	Insulated
Isoliermaterial:	Polybutylene Terephthalate (PBT)
Maximale Betriebstemperatur:	+ 85 C
Minimale Betriebstemperatur:	- 25 C
Montageart:	Panel
Produkt-Typ:	High Density D-Sub Connectors
Gehäusematerial:	Steel
Gehäusebeschichtung:	Tin
Verpackung ab Werk:	27
Unterkategorie:	D-Sub Connectors
Handelsname:	NANOOK

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Ausgewählte Attribute: 0

Dokument filtern:

USHTS:: 8536694040
ECCN:: EAR99

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