560-005-000-210

EDAC
587-560-005-000-210
560-005-000-210

Herst.:

Beschreibung:
Pin & Socket-Steckverbindungen 560 Series Wire to Wire / Wire to Board 2.5mm pitch connector with 5 contact spaces, female, white, Wire Insulation oe1.00 to oe1.30

ECAD Model:
Den kostenlosen Library Loader herunterladen, um diese Datei für Ihr ECAD Tool zu konvertieren. Weitere Infos zu ECAD-Modell.

Auf Lager: 239

Lagerbestand:
239 sofort lieferbar
Lieferzeit ab Hersteller:
18 Wochen Geschätzte Produktionszeit des Werks für Mengen, die größer als angezeigt sind.
Minimum: 1   Vielfache: 1
Stückpreis:
-,-- €
Erw. Preis:
-,-- €
Vorauss. Zolltarif:

Preis (EUR)

Menge Stückpreis
Erw. Preis
0,80 € 0,80 €
0,68 € 6,80 €
0,636 € 15,90 €
0,611 € 61,10 €
0,55 € 137,50 €
0,50 € 250,00 €
0,445 € 445,00 €
0,402 € 1.005,00 €
0,389 € 1.945,00 €

Produktattribut Attributwert Attribut auswählen
EDAC
Produktkategorie: Pin & Socket-Steckverbindungen
RoHS:  
Receptacle Housings
5 Position
1 Row
2.5 mm
Crimp
Free Hanging
Polybutylene Terephthalate (PBT)
250 V
560
Marke: EDAC
Kontakttyp: Pin, Socket
Entflammbarkeitseinstufung: UL 94 V-0
Gehäusefarbe: White
Gehäuse-Anschlussart: Receptacle
Montagewinkel: Straight
Produkt-Typ: Pin & Socket Connectors
Verpackung ab Werk: 500
Unterkategorie: Pin & Socket Connectors
Gewicht pro Stück: 2,100 g
Produkte gefunden:
Um ähnliche Produkte anzuzeigen, wählen Sie mindestens ein Kontrollkästchen aus
Um ähnliche Produkte in dieser Kategorie anzuzeigen, wählen Sie mindestens ein Kontrollkästchen oben aus.
Ausgewählte Attribute: 0

TARIC:
8536699099
CNHTS:
8538900000
CAHTS:
8536690040
USHTS:
8538908180
JPHTS:
853890000
KRHTS:
8536699000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

E-Seal Waterproof Connectors

EDAC E-Seal Waterproof Connectors use a unique epoxy sealing process that seals the entire back of the connector rather than at the individual pins. This produces a complete seal with a smooth finish and guarantees no water ingress up to IP67 standards. The E-Seal system offers a full range of D-subs from DB 9 to a maximum of 78 positions. Standard and high-density footprints are available in vertical or right angle orientations. EDAC E-Seal Waterproof Connectors plating options vary from gold flash to 30u” of gold and include a wide variety of mounting options.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.